[labnetwork] Foggy residue after oxygen plasma etch of polyimide

[Fouad Karouta]

Hi Vivian,

In the past we did etch polyimide in O2/CF4 plasma though the CF4/O2 ratio was like 10% but I believe a good removal of the polyimide requires some fluorine.

Hope this helps,
Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics and Engineering
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Vivian Yu
Sent: Thursday, 28 July 2016 6:38 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Foggy residue after oxygen plasma etch of polyimide

Good afternoon,

I am etching 7 microns of spin-coated polyimide using a chrome mask and a direct oxygen plasma in a PlasmaTherm790 at 100 mTorr of pressure, and I am observing a foggy pale yellow residue after and during the etch that can be rubbed off easily with a clean room swab.

Has anyone on Labnetwork observed this same thing, or know what this might be?

Thanks,
Vivian Yu
Princeton University
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20160728/dbb6f307/attachment.html>