[labnetwork] Flip Chip Bonding needs

[Michael Khbeis]

Kamal 

We can accommodate. What type of bond?

Best,

Dr. Michael Khbeis
Washington Nanofab Facility
University of Washington
Fluke Hall, Box 352143
(O) 206.543.5101
(C) 443.254.5192
khbeis at uw.edu

> On Mar 13, 2017, at 2:17 PM, Kamal Yadav <kamal.yadav at gmail.com> wrote:
> 
> Dear All,
> 
> Kindly let me know if you know or if you can provide flip chip bonding services at a University cleanroom or similar, on the west coast preferably [due to our own location], but we are open to other places as well.   
> 
> Bonding force required: Around 50 Kg
> Die Size: 5 mm to 35 mm.
> Alignment: 5 micron or better.
> 
> -- 
> Thanks,
> Kamal 
> 
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