[labnetwork] Flip Chip Bonding needs

[Luciani, Vincent (Fed)]

Hello Kamal,

Add us to the list.  We have the following:

https://www.nist.gov/laboratories/tools-instruments/nanofab-tool-tresky-t-3000-fc3-hf-flip-chip-bonder

[cid:image003.jpg at 01D29D6F.341DBAE0]
Best,

Vince


Vincent K. Luciani
NanoFab Manager
Center for Nanoscale Science and Technology<http://www.cnst.nist.gov/>
National Institute of Standards and Technology
100 Bureau Drive, MS 6201
Gaithersburg, MD 20899-6200 USA
+1-301-975-2886





From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kamal Yadav
Sent: Monday, March 13, 2017 5:17 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Flip Chip Bonding needs

Dear All,

Kindly let me know if you know or if you can provide flip chip bonding services at a University cleanroom or similar, on the west coast preferably [due to our own location], but we are open to other places as well.

Bonding force required: Around 50 Kg
Die Size: 5 mm to 35 mm.
Alignment: 5 micron or better.

--
Thanks,
Kamal

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20170315/8d51dbd9/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: image003.jpg
Type: image/jpeg
Size: 28480 bytes
Desc: image003.jpg
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20170315/8d51dbd9/attachment.jpg>