[labnetwork] Flip Chip Bonding needs

[Brian Thibeault]

To all, Please add UCSB to the list as well.

 

Thanks,

Brian

 

 

***********************************

Brian Thibeault, Ph.D

Project Scientist/Manager

UCSB Nanofabrication Facility

Santa Barbara, CA 93106

 

805-893-2268

 <http://www.nanotech.ucsb.edu> www.nanotech.ucsb.edu

 <mailto:thibeault at ece.ucsb.edu> thibeault at ece.ucsb.edu

 

 

 

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Robert Avila
Sent: Tuesday, March 14, 2017 9:16 AM
To: julia.aebersold at louisville.edu; Michael Khbeis <khbeis at uw.edu>; Kamal Yadav <kamal.yadav at gmail.com>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Flip Chip Bonding needs

 

Good to see Dr. Khbeis and others respond. 

 

Finetech has die bonders installed at many Universities…to name a few and my apologies for those I missed – 

 

University of Arizona,

University of Arizona State

Cal Berkeley

Cal Davis

Stanford

Cal Tech

University of Washington

University of Louisville

University of Colorado State

University of Alaska

University of Alberta

University of Arkansas

University of S.Florida

MIT

Harvard

Rice

 

 

 

Regards,

Robert Avila

(')480.231.7902 mobile 

(')480-893-1630 office 

finetechusa.com <http://www.finetechusa.com/>  8

 

 

From: labnetwork-bounces at mtl.mit.edu <mailto:labnetwork-bounces at mtl.mit.edu>  [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of julia.aebersold at louisville.edu <mailto:julia.aebersold at louisville.edu> 
Sent: Tuesday, March 14, 2017 7:25 AM
To: Michael Khbeis <khbeis at uw.edu <mailto:khbeis at uw.edu> >; Kamal Yadav <kamal.yadav at gmail.com <mailto:kamal.yadav at gmail.com> >
Cc: labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu> 
Subject: Re: [labnetwork] Flip Chip Bonding needs

 

We also have flip chip bonding capabilities.  50kg seems quite a bit and would crush most silicon and/or glass substrates.

 

Cheers!

 

Julia Aebersold, Ph.D.

Cleanroom Manager

Micro/Nano Technology Center

University of Louisville

Shumaker Research Building, Room 233

2210 South Brook Street

Louisville, KY  40292

 

502-852-1572

 <http://louisville.edu/micronano/> http://louisville.edu/micronano/

 

From: labnetwork-bounces at mtl.mit.edu <mailto:labnetwork-bounces at mtl.mit.edu>  [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Michael Khbeis
Sent: Tuesday, March 14, 2017 7:55 AM
To: Kamal Yadav <kamal.yadav at gmail.com <mailto:kamal.yadav at gmail.com> >
Cc: labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu> 
Subject: Re: [labnetwork] Flip Chip Bonding needs

 

Kamal 

 

We can accommodate. What type of bond?

 

Best,

Dr. Michael Khbeis

Washington Nanofab Facility
University of Washington
Fluke Hall, Box 352143
(O) 206.543.5101 <tel:206.543.5101> 
(C) 443.254.5192 <tel:443.254.5192> 
khbeis at uw.edu <mailto:khbeis at uw.edu> 


On Mar 13, 2017, at 2:17 PM, Kamal Yadav <kamal.yadav at gmail.com <mailto:kamal.yadav at gmail.com> > wrote:

Dear All,

 

Kindly let me know if you know or if you can provide flip chip bonding services at a University cleanroom or similar, on the west coast preferably [due to our own location], but we are open to other places as well.   

 

Bonding force required: Around 50 Kg

Die Size: 5 mm to 35 mm.

Alignment: 5 micron or better.


 

-- 

Thanks,

Kamal 

 

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