[labnetwork] Flip Chip Bonding needs

[Kamal Yadav]

Dear All,

Thanks for your responses, I have contacted separately people who have
responded to this.

On Mon, Mar 20, 2017 at 8:25 PM, Jeff Clarkson <jclarkson at google.com> wrote:

> That's a great list!
>
> We have an opening in our microfabrication lab here at Verily (Formerly
> Google Life Sciences) for a packaging/assembly/flip-chip bonding process
> engineer.  Most of their work will be oriented around chip bonding
> processes using a Fineplacer Femto automated system.   A job description is
> attached.
>
> Please submit resumes to me directly.
>
> Regards,
>
> On Wed, Mar 15, 2017 at 1:36 PM, Brian Thibeault <thibeault at ece.ucsb.edu>
> wrote:
>
>> To all, Please add UCSB to the list as well.
>>
>>
>>
>> Thanks,
>>
>> Brian
>>
>>
>>
>>
>>
>> ***********************************
>>
>> Brian Thibeault, Ph.D
>>
>> Project Scientist/Manager
>>
>> UCSB Nanofabrication Facility
>>
>> Santa Barbara, CA 93106
>>
>>
>>
>> 805-893-2268 <(805)%20893-2268>
>>
>> www.nanotech.ucsb.edu
>>
>> thibeault at ece.ucsb.edu
>>
>>
>>
>>
>>
>>
>>
>> *From:* labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl
>> .mit.edu] *On Behalf Of *Robert Avila
>> *Sent:* Tuesday, March 14, 2017 9:16 AM
>> *To:* julia.aebersold at louisville.edu; Michael Khbeis <khbeis at uw.edu>;
>> Kamal Yadav <kamal.yadav at gmail.com>
>>
>> *Cc:* labnetwork at mtl.mit.edu
>> *Subject:* Re: [labnetwork] Flip Chip Bonding needs
>>
>>
>>
>> Good to see Dr. Khbeis and others respond.
>>
>>
>>
>> Finetech has die bonders installed at many Universities…to name a few and
>> my apologies for those I missed –
>>
>>
>>
>> University of Arizona,
>>
>> University of Arizona State
>>
>> Cal Berkeley
>>
>> Cal Davis
>>
>> Stanford
>>
>> Cal Tech
>>
>> University of Washington
>>
>> University of Louisville
>>
>> University of Colorado State
>>
>> University of Alaska
>>
>> University of Alberta
>>
>> University of Arkansas
>>
>> University of S.Florida
>>
>> MIT
>>
>> Harvard
>>
>> Rice
>>
>>
>>
>>
>>
>>
>>
>> Regards,
>>
>> Robert Avila
>>
>> (')480.231.7902 <(480)%20231-7902> mobile
>>
>> (')480-893-1630 <(480)%20893-1630> office
>>
>> finetechusa.com <http://www.finetechusa.com/> *8*
>>
>>
>>
>>
>>
>> *From:* labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl
>> .mit.edu <labnetwork-bounces at mtl.mit.edu>] *On Behalf Of *
>> julia.aebersold at louisville.edu
>> *Sent:* Tuesday, March 14, 2017 7:25 AM
>> *To:* Michael Khbeis <khbeis at uw.edu>; Kamal Yadav <kamal.yadav at gmail.com>
>> *Cc:* labnetwork at mtl.mit.edu
>> *Subject:* Re: [labnetwork] Flip Chip Bonding needs
>>
>>
>>
>> We also have flip chip bonding capabilities.  50kg seems quite a bit and
>> would crush most silicon and/or glass substrates.
>>
>>
>>
>> Cheers!
>>
>>
>>
>> Julia Aebersold, Ph.D.
>>
>> Cleanroom Manager
>>
>> Micro/Nano Technology Center
>>
>> University of Louisville
>>
>> Shumaker Research Building, Room 233
>>
>> 2210 South Brook Street
>>
>> Louisville, KY  40292
>>
>>
>>
>> 502-852-1572 <(502)%20852-1572>
>>
>> http://louisville.edu/micronano/
>>
>>
>>
>> *From:* labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl
>> .mit.edu <labnetwork-bounces at mtl.mit.edu>] *On Behalf Of *Michael Khbeis
>> *Sent:* Tuesday, March 14, 2017 7:55 AM
>> *To:* Kamal Yadav <kamal.yadav at gmail.com>
>> *Cc:* labnetwork at mtl.mit.edu
>> *Subject:* Re: [labnetwork] Flip Chip Bonding needs
>>
>>
>>
>> Kamal
>>
>>
>>
>> We can accommodate. What type of bond?
>>
>>
>>
>> Best,
>>
>> Dr. Michael Khbeis
>>
>> Washington Nanofab Facility
>> University of Washington
>> Fluke Hall, Box 352143
>> (O) 206.543.5101
>> (C) 443.254.5192
>> khbeis at uw.edu
>>
>>
>> On Mar 13, 2017, at 2:17 PM, Kamal Yadav <kamal.yadav at gmail.com> wrote:
>>
>> Dear All,
>>
>>
>>
>> Kindly let me know if you know or if you can provide flip chip bonding
>> services at a University cleanroom or similar, on the west coast preferably
>> [due to our own location], but we are open to other places as well.
>>
>>
>>
>> Bonding force required: Around 50 Kg
>>
>> Die Size: 5 mm to 35 mm.
>>
>> Alignment: 5 micron or better.
>>
>>
>>
>> --
>>
>> Thanks,
>>
>> Kamal
>>
>>
>>
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>>
>>
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>>
>
>
> --
>
>
> Jeffrey P. Clarkson, *Ph.D.*  |  Hardware Engineer  |
> jclarkson at google.com  |  650-495-2071 <(650)%20495-2071>
> *v**erily*
>



-- 
Thanks,
Kamal
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