[labnetwork] Diced Samples Glued to UV Release Tape

[Hassan, Sa'ad]

Hello All,

As part of the last step of processing, I take wafers (Si and SiC), with photoresist on top,  dice them, die expand them on a hotplate at 55 degrees Celsius. And finally UV release the tape. I've noticed that sporadically, rather than the tape losing  adhesion, the opposite happens: the die end up cemented to the tape. Has anyone experienced anything like this before?

Cheers,
Sa'ad
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