[labnetwork] RIE through Silicon

Tue Apr 12 17:18:26 EDT 2022

We have been using crystal bond.  It provides good thermal transfer and it cleans up well with solvents.

Cheers!

Julia Aebersold, Ph.D.
Manager, Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292
(502) 852-1572

http://louisville.edu/micronano/

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Hao-Chieh Hsieh
Sent: Tuesday, April 12, 2022 2:54 PM
To: Chang, Long <lvchang at central.uh.edu>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] RIE through Silicon

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Hi Long,
We used a vacuum grease to attach the silicon wafer to the Al carrier for DRIE etching in Utah nanofab . I was able to etch a 50x50um opneing through a standard 4-inch silicon wafer.  Releasing is time-consuming by soaking overnight in xylene and final device came out pretty good. We can discuss more.

Thanks

Hao-Chieh

On Tue, Apr 12, 2022 at 11:22 AM Kamal Yadav <kamal.yadav at gmail.com<mailto:kamal.yadav at gmail.com>> wrote:
Hi Long,

Your PR will mostly char/ or burn, so cool grease is recommended but when you do a through silicon via, you may be exposing the cool grease to plasma and I am not sure what kind of damage it will bring to the devices/chamber. Of course exposing plasma to photoresist (if that works) is fine. Thanks

On Tue, Apr 12, 2022 at 9:07 AM Hollingshead, Dave <hollingshead.19 at osu.edu<mailto:hollingshead.19 at osu.edu>> wrote:
Hi Long,

We do this routinely with our DRIE system. As Jer mentioned, we typically use small drops of santovac 5 oil to adhere the two wafers together to provide thermal conduction. In our case we see etch rate changes or PR "burning" without a good thermal conductor between the samples.

-Dave

From: labnetwork <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Jeremy Upham
Sent: Monday, April 11, 2022 23:08
Cc: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] RIE through Silicon

I think your plan could work, so I'm not sure that I see the problem In my experience the carbon in the PR can contribute to the plasma chemistry and affect the etch, so I tend to use vacuum grease as a thermally conducting binder between
I think your plan could work, so I'm not sure that I see the problem

In my experience the carbon in the PR can contribute to the plasma chemistry and affect the etch, so I tend to use vacuum grease as a thermally conducting binder between the etched sample and the backing wafer instead. Though your system may well work for your recipe.

Hope that helps,

Jer Upham PhD
Senior Lab Manager / Research Scientist
Quantum Photonics Group
University of Ottawa
Tel.: 1 (613) 562-5800 ext 7325

On Mon, Apr 11, 2022 at 6:54 PM Chang, Long <lvchang at central.uh.edu<mailto:lvchang at central.uh.edu>> wrote:
Attention : courriel externe | external email
Hi Guys,

I have an Oxford RIE with backside Helium. I want to etch through the silicon wafer (380um thick). The largest pattern is a 1mm diameter circle. My plan is to ride the 4" sample wafer on a 4" carrier wafer with PR. Does anyone have a good solution to this problem?

Thanks,
Long

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--
Thanks,
Kamal

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