[labnetwork] Oxford Wafer Jam/Break

[Chang, Long]

Hi Guys,

After etching through 380um of Silicon, the loading arm would get jammed during unloading, see photo. The problem was fixed by adding a 15min step to do nothing step to allow the clamp to cool down before unloading. Now the problem is back and the plan is to increase the cool down time until it stops jamming. Is there a better way to avoid this problem? Should the PR on the wafer edge be removed?

Thanks,
Long
[cid:F07A4AC3-BF8B-4912-90D8-DC2559869BEA at serc.dhcp.e.uh.edu]
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