[labnetwork] wirebonder for shared academic facility

[Edmond Chow]

Hi,

Thank you everyone for your advice, I really appreciate it.

*Edmond K.C. Chow*

-------------------------------------------------------------------------

*Nick Holonyak, Jr. Micro and Nanotechnology Lab (HMNTL)*

*University of Illinois*
Rm 2300, MC-249

208 North Wright St. Urbana, IL 61801

Fax:217-244-6375

Email: echow at illinois.edu

Web: http://mntl.illinois.edu/

On Thu, Sep 1, 2022 at 11:39 AM Martin, Michael <
michael.martin at louisville.edu> wrote:

> Hi Edmond,
>    Our take on students wire bonding is that they should just leave it to
> the staff unless they are going to be regularly performing it for years.
> It is tedious and takes a degree of patience.
>
> Regards,
>    Michael
> ------------------------------
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Edmond
> Chow <kchow10 at gmail.com>
> *Sent:* Wednesday, August 31, 2022 4:08 PM
> *To:* Fab Network <labnetwork at mtl.mit.edu>
> *Subject:* [labnetwork] wirebonder for shared academic facility
>
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> We are looking to purchase a new wire bonder for our multi-user facility.
> We currently have one old K&S 4524AD ball bonder. However, it has been
> difficult to maintain as the tool is prone to be messed up by inexperienced
> users, whom we have encountered often in our lab.
>
> We are seeking advice for a more user-friendly wire bonder, which can
> better tolerate some operator error without messing up the machine too
> badly.
>
> Thank you in advance.
>
> --
> Edmond Chow
>
> *Nick Holonyak, Jr. Micro and Nanotechnology Lab (HMNTL)*
>
> *University of Illinois*
> Rm 2300, MC-249
>
> 208 North Wright St. Urbana, IL 61801
>
> Email: echow at illinois.edu
>
> Web: http://mntl.illinois.edu/
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-- 
Edmond Chow
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