[labnetwork] 200 mm Cu Electroplating System for Si Through Silicon Via

[James Grant]

Hello labnetwork,

Little out of my comfort zone on this one. Been tasked with looking at electroplating of Cu for Si through silicon vias. Our current system is very much homemade and it does a good job but is not capable of 200 mm wafer processing. It would also be good to get a semi-automated system and I have been told there is significant budget available.

I've had a brief look and like the look (at first glance) of ClassOne's Solstice LT<https://classone.com/plating-surface-preparation-systems/solstice-lt-pilot-production-systems/>  and Technic's Semcon 1000<https://www.technic.com/applications/semiconductor/semiconductor-equipment/semcon-1000-semiconductor-electroplating-tool>.

Would appreciate thoughts/experiences of labnetwork community on their current Cu electroplating systems.

Cheers,
James
Dr. James Paul Grant
Research Engineer in Plasma Processing
Plasma Processing Group
james.grant at glasgow.ac.uk<mailto:james.grant at glasgow.ac.uk>
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