[labnetwork] [JOB] Opening at NIST Gaithersburg: Advanced Packaging & Photonic Integration Researcher

[Davanco, Marcelo I. (Fed)]

Hello all,

The NIST Physical Measurement Lab's  Microsystems and Nanotechnology Division in Gaithersburg, MD, is seeking highly motivated researchers at various career levels (BSc, MSc, or PhD) to join a CHIPS Metrology team working on advancing measurement science for next-generation hybrid advanced packaging and photonic heterogeneous integration.

Hiring and specific responsibilities will be commensurate with the candidate's experience and degree level.

The main responsibilities are:
Fabrication & Process: Fabricate Si, SiO2, SiN and GaAs test vehicle chips for flip-chip direct fusion and hybrid bonding experiments.
Maintain and optimize cleanroom processes, including cleaning and handling protocols.
Metrology: Perform surface and thin-film characterization using AFM, spectroscopic ellipsometry, SEM, and IR transmission microscopy.
Team Coordination: Work within a collaborative environment to support materials characterization and bond strength testing.

For candidates with advanced degrees (PhD) or significant, relevant industry experience, the role provides opportunities for:
PIC Design: Design of heterogeneous integrated photonic devices (on-chip lasers/amplifiers) using SiN or TFLN platforms.
Custom Metrology: Developing advanced bonded-wafer inspection capabilities and investigating how fabrication limits impact device performance.
Simulations: Utilizing Lumerical, Tidy3d, or COMSOL for optoelectronic device modeling.

Minimum Requirements (BSc Level):
Degree: BS in Physics, Electrical Engineering, Materials Science, or a related field.
Foundational Fab: Significant, hands-on experience in semiconductor device fabrication (Optical lithography, RIE/ICP, PVD/CVD, wet etching).
Technical Skills: Proficiency in programming (Python, Matlab, or Java) and standard characterization (Profilometry, Optical Microscopy).

Preferred/Senior Qualifications:
Advanced Degree: MS or PhD in a relevant field.
Specialized Knowledge: Experience with flip-chip/hybrid bonding, III-V semiconductor processing, electron-beam lithography, various spectroscopic modalities (XPS, FTIR, Raman, PL).

US Citizenship is preferred, but not required.

Please feel free to contact me (marcelo.davanco[at]nist.gov) directly about this opportunity. Please include a CV and a brief description of your cleanroom experience and specific research interests.

Marcelo

--
Marcelo Davanco
National Institute of Standards and Technology
100 Bureau Drive, Stop 6810
Gaithersburg, MD 20899-6810
phone: 301-975-3089
marcelo.davanco[at]nist.gov
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