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Apologies, I meant no other responses of any kind!<br>
<br>
: )<br>
<br>
Mac Hathaway wrote:
<blockquote cite="mid:4E04B80B.1050906@cns.fas.harvard.edu" type="cite">
<pre wrap="">Hi Keith,
Since I see no other better responses yet, I'll give you my two cents
(not being a sputtering guru, myself):
Sounds like something is getting hot. Things to check:
Loose RF connections in the chamber, and back to the tuning network.
Also, check inside your tuning network for loose connections.
Does your forward/reflected power change over the day?
Another place to look is your RF power supply.
Mac Hathaway
Harvard CNS
Keith Bradshaw wrote:
</pre>
<blockquote type="cite">
<pre wrap="">We are sputtering TiO2 .
We begin the day with a 250 angstrom rate....each subsequent run is
reduced by 10-15% in rate until we are at a 125 angstrom rate. We are
not changing anything.
Next day we begin again at 250.
Tried argon clean between runs, tried 3 hour wait between runs, we are
using a load lock and vacuum looks stable , still rate drops on each run.
Any ideas?
cordially,
Keith Bradshaw
Dallas
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