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<p class=MsoNormal><span style='color:#1F497D'>Hi Rick,<o:p></o:p></span></p>
<p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p>
<p class=MsoNormal><span style='color:#1F497D'>I had a similar issue on a
different brand of plasma system in the past. The rough pump valve had received
some damage to the o-ring seal and even though it was closed, the fault allowed
the system to bleed foreline atmosphere back into the chamber. As foreline is
still relatively low pressure it did not fault for high chamber pressure, but
we did get fomblin into the chamber during processing.<o:p></o:p></span></p>
<p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p>
<p class=MsoNormal><span style='color:#1F497D'>Hope this helps,<o:p></o:p></span></p>
<p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p>
<p class=MsoNormal><span style='color:#1F497D'>Regards,<o:p></o:p></span></p>
<p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p>
<p class=MsoNormal><span style='color:#1F497D'>Mike<o:p></o:p></span></p>
<p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p>
<div>
<p class=MsoNormal><b><span style='font-family:"Arial","sans-serif";color:black'>Mike
Tiner<br>
</span></b><span style='font-size:10.0pt;font-family:"Arial","sans-serif";
color:black'>Manager, Fabrication and Microscopy Facilities</span><span
style='color:black'><o:p></o:p></span></p>
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style='color:black'><o:p></o:p></span></p>
<p class=MsoNormal><span style='font-size:10.0pt;font-family:"Arial","sans-serif";
color:#0391BE'>PO Box 54224, Khalifa City<o:p></o:p></span></p>
<p class=MsoNormal><span style='font-size:10.0pt;font-family:"Arial","sans-serif";
color:#0391BE'>Abu Dhabi, United Arab Emirates<br>
Office +971 2 810 8122</span><span style='color:black'><o:p></o:p></span></p>
<p class=MsoNormal><span style='font-size:10.0pt;font-family:"Arial","sans-serif";
color:#0391BE'>Direct +971 2 810 9053<br>
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<p class=MsoNormal><span style='font-size:10.0pt;font-family:"Arial","sans-serif";
color:#0391BE'>Email <a href="mailto:mpotter@masdar.ac.ae">mtiner@masdar.ac.ae</a></span><span
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<p class=MsoNormal><span style='color:black'> <o:p></o:p></span></p>
<p class=MsoNormal><span style='font-size:10.0pt;font-family:"Arial","sans-serif";
color:#0391BE'><a href="http://www.masdar.ac.ae/" target="_blank">http://www.masdar.ac.ae</a></span><span
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</span><span style='font-size:10.0pt;font-family:Webdings;color:#0391BE'>P </span><i><span
style='font-size:8.0pt;font-family:"Arial","sans-serif";color:#0391BE'>Please
consider the environment before printing this email<br>
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<p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p>
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<p class=MsoNormal><b><span style='font-size:10.0pt;font-family:"Tahoma","sans-serif"'>From:</span></b><span
style='font-size:10.0pt;font-family:"Tahoma","sans-serif"'>
labnetwork-bounces@mtl.mit.edu [mailto:labnetwork-bounces@mtl.mit.edu] <b>On
Behalf Of </b>Morrison, Richard H., Jr.<br>
<b>Sent:</b> Wednesday, July 27, 2011 3:59 PM<br>
<b>To:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> [labnetwork] Need RIE help<o:p></o:p></span></p>
</div>
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<p class=MsoNormal><o:p> </o:p></p>
<p class=MsoNormal>Hi Everyone,<o:p></o:p></p>
<p class=MsoNormal><o:p> </o:p></p>
<p class=MsoNormal>Our facility uses an STS RIE tool (100mm wafers), to etch
Nitrides/Oxides/Ti and resist cleans. I have a big problem when we use O2 to
clean off resist from wafers. It seems that just running O2 plasma we etch
1000A/min of SiO2. It should be impossible to etch SiO2 with O2 plasma.<o:p></o:p></p>
<p class=MsoNormal><o:p> </o:p></p>
<p class=MsoNormal>In trouble shooting we have done the following, change the
Teflon wafer holder, disconnected the SF6, CF4 and CHF3 tanks and capped the
lines, then pumped the machine down and just ran O2 and we still etched the
SiO2 at 1000A/min. We have a plasma scope and the F peak is clipped of in
height during the O2 plasma clean?<o:p></o:p></p>
<p class=MsoNormal><o:p> </o:p></p>
<p class=MsoNormal>Does anybody have any ideas on what may be going on.<o:p></o:p></p>
<p class=MsoNormal><o:p> </o:p></p>
<p class=MsoNormal>Thanks in advance,<o:p></o:p></p>
<p class=MsoNormal>Rick<o:p></o:p></p>
<p class=MsoNormal><o:p> </o:p></p>
<p class=MsoNormal><o:p> </o:p></p>
<p class=MsoNormal><o:p> </o:p></p>
<p class=MsoNormal><o:p> </o:p></p>
<p class=MsoNormal>Rick Morrison<o:p></o:p></p>
<p class=MsoNormal>Senior Member Technical Staff <o:p></o:p></p>
<p class=MsoNormal>Acting Group Leader Mems Fabrication<o:p></o:p></p>
<p class=MsoNormal>Draper Laboratory<o:p></o:p></p>
<p class=MsoNormal>555 Technology Square<o:p></o:p></p>
<p class=MsoNormal>Cambridge, MA 02139<o:p></o:p></p>
<p class=MsoNormal><o:p> </o:p></p>
<p class=MsoNormal>617-258-3420<o:p></o:p></p>
<p class=MsoNormal><o:p> </o:p></p>
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