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</o:shapelayout></xml><![endif]--></head><body lang=EN-US link=blue vlink=purple><div class=WordSection1><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Ian,<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>I usually like to install VMP’s with a minimum of 4- Valve stick where I populate as many sticks as the installation calls for. However, in aisle or service chases where you could have more than four (4) tools requiring this gas, I would install 8-valve stick panels. The cost of a 4-stick manifold is negligible compared to the cost of running one new ¼” EP SS316L tubing from the lateral to a new drop location. Let alone that you will have to shutdown the gas source and all tools utilizing the gas in question.<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p><div><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Rizik Michael, PE<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Principal<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Integrated Engineering Services<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Office: +408 261 3500, Ext. 201<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Cell: +408 718 0927<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><a href="http://www.iesengineering.net">www.iesengineering.net</a><o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p></div><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p><div><div style='border:none;border-top:solid #B5C4DF 1.0pt;padding:3.0pt 0in 0in 0in'><p class=MsoNormal><b><span style='font-size:10.0pt;font-family:"Tahoma","sans-serif"'>From:</span></b><span style='font-size:10.0pt;font-family:"Tahoma","sans-serif"'> labnetwork-bounces@mtl.mit.edu [mailto:labnetwork-bounces@mtl.mit.edu] <b>On Behalf Of </b>Ian Harvey<br><b>Sent:</b> Thursday, September 20, 2012 8:58 AM<br><b>To:</b> labnetwork@mtl.mit.edu<br><b>Subject:</b> [labnetwork] question to cleanroom colleagues: distributed vs. manifolded gases...<o:p></o:p></span></p></div></div><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal>Dear micro/nano cleanroom colleagues:<o:p></o:p></p><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>Please critique the following thought process and give your insight which approach is best in planning the process gas piping for a new installation. <o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>Which do you use (VMP/distributed) in your new facility or new tool installations and are you happy?<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>If VMP's, what is the threshold number of tools for which you consider it justifiable to use VMP's?<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal><b>valve manifold panels:</b><o:p></o:p></p></div><div><p class=MsoNormal>pro's: <o:p></o:p></p></div><div><p class=MsoNormal>• clean, organized installation, flexible to any future installation, populated when needed<o:p></o:p></p></div><div><p class=MsoNormal>• system contamination attained by ability to purge regulators with venturi<o:p></o:p></p></div><div><p class=MsoNormal>• leaks or failures within isolated runs do not contaminate other processes or cause downtime on other tools<o:p></o:p></p></div><div><p class=MsoNormal>• prevent cross-talk between process MFC's, using the same gases<o:p></o:p></p></div><div><p class=MsoNormal>• does not cause system downtime when installing new processes<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>Con's<o:p></o:p></p></div><div><p class=MsoNormal>• up front cost is greater, though not sure how much<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal><b>Process gases distributed through shared supply line, and laterals / drops:</b><o:p></o:p></p></div><div><p class=MsoNormal>pro's:<o:p></o:p></p></div><div><p class=MsoNormal>• Up front cost is lower (not sure how much-- it depends...)<o:p></o:p></p></div><div><p class=MsoNormal>• cross-talk can be minimized by a regulator at each tool<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>Con's:<o:p></o:p></p></div><div><p class=MsoNormal>• system downtime for all tools sharing the gases during<o:p></o:p></p></div><div><p class=MsoNormal>• cost may be comparable depending upon number of valved drops, and how good the planning is for predicting future installation points<o:p></o:p></p></div><div><p class=MsoNormal>• see pro's above in VMP<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>Thank you all!<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>--Ian<o:p></o:p></p></div><p class=MsoNormal style='margin-bottom:12.0pt'><o:p> </o:p></p><div><div><div><div><div><div><p class=MsoNormal><span style='font-size:7.0pt;font-family:"Helvetica","sans-serif";color:black'>********************************************<br>Ian R. Harvey, Ph.D.<br>Research Associate Professor<br>Department of Mechanical Engineering<o:p></o:p></span></p></div><div><p class=MsoNormal><span style='font-size:7.0pt;font-family:"Helvetica","sans-serif";color:black'>Adjunct Associate Professor<o:p></o:p></span></p></div><div><p class=MsoNormal><span style='font-size:7.0pt;font-family:"Helvetica","sans-serif";color:black'>Department of Electrical & Computer Engineering<br>2511 SMBB (USTAR)<br><br>Associate Director,<o:p></o:p></span></p></div><div><p class=MsoNormal><span style='font-size:7.0pt;font-family:"Helvetica","sans-serif";color:black'>Utah Nanofab & <o:p></o:p></span></p></div><div><p class=MsoNormal><span style='font-size:13.5pt;font-family:"Helvetica","sans-serif";color:black'>Micron Microscopy Core<o:p></o:p></span></p></div><div><p class=MsoNormal><span style='font-size:13.5pt;font-family:"Helvetica","sans-serif";color:black'><o:p> </o:p></span></p></div><div><p class=MsoNormal><span style='font-size:13.5pt;font-family:"Helvetica","sans-serif";color:black'>801/585-6162 (voicemail)<br>801/581-5676 (lab main number)<br><a href="http://www.nanofab.utah.edu">www.nanofab.utah.edu</a><br><br><b>mail to:</b><o:p></o:p></span></p></div><div><p class=MsoNormal><span style='font-size:13.5pt;font-family:"Helvetica","sans-serif";color:black'>Utah Nanofab / University of Utah<o:p></o:p></span></p></div><div><p class=MsoNormal><span style='font-size:13.5pt;font-family:"Helvetica","sans-serif";color:black'>36 South Wasatch Drive<o:p></o:p></span></p></div><div><p class=MsoNormal><span style='font-size:13.5pt;font-family:"Helvetica","sans-serif";color:black'>Suite 2500<br>Salt Lake City, Utah 84112-9011<o:p></o:p></span></p></div></div></div></div></div></div></div></body></html>