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<div class="moz-cite-prefix">I second Bill's motion. It would be
best if we limited the discussions to topics that provide the
environment (infrastructure, equipment, safety, management,
billing, etc) that allows our customers to do their work.<br>
<br>
One could ignore items that are not of interest but I am concerned
that the forum may be "flooded" with process-related questions.<br>
<br>
Iulian<br>
<pre class="moz-signature" cols="72">iulian Codreanu, Ph.D.
Director of Operations, UD Nanofab
149 Evans Hall
Newark, DE 19716
302-831-2784</pre>
On 7/31/2013 5:01 PM, Charles Ellis wrote:<br>
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<blockquote cite="mid:CE1EE424.1A955%25elliscd@auburn.edu"
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<div>I could be wrong as the original intent of this forum, but I
welcome the process questions.. I think it is a great place for
the old guys like me and some of you to share our experiences
and maybe help some of these young guys. As a lab manager I
also welcome the operations discussions – it does not seem that
this forum is overly busy and so I vote we encourage process
questions as well as operational questions. It seems to have
been working quite well so far. I very much enjoy the traffic I
have seen over the years..</div>
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<div>Just my 2 cents!</div>
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<div>Charles Ellis…</div>
<div>Auburn..</div>
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<span style="font-weight:bold">From: </span>Bill Flounders
<<a moz-do-not-send="true"
href="mailto:bill@eecs.berkeley.edu">bill@eecs.berkeley.edu</a>><br>
<span style="font-weight:bold">Date: </span>Wednesday, July
31, 2013 2:00 PM<br>
<span style="font-weight:bold">To: </span>Chandrashekar S
Kambar <<a moz-do-not-send="true"
href="mailto:kambar009@gmail.com">kambar009@gmail.com</a>>,
"<a moz-do-not-send="true"
href="mailto:labnetwork@mtl.mit.edu">labnetwork@mtl.mit.edu</a>"
<<a moz-do-not-send="true"
href="mailto:labnetwork@mtl.mit.edu">labnetwork@mtl.mit.edu</a>><br>
<span style="font-weight:bold">Subject: </span>Re:
[labnetwork] E-Beam Evaporation, Ni optimization.<br>
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<div class="moz-cite-prefix">Chandrashekar S Kambar,<br>
Lab Network is primarily for operations discussions<br>
or facility wide issues rather than detailed
nanofabrication questions.<br>
Please consider the mems talk venue for<br>
questions at this level of process detail.<br>
I also encourage you to contact Process Support<br>
at CHA Industries<br>
<a moz-do-not-send="true" class="moz-txt-link-freetext"
href="http://www.chaindustries.com/">http://www.chaindustries.com/</a><br>
<br>
I welcome dissenting opinion from the network<br>
if I have misrepresented our forum.<br>
<br>
Thank you<br>
Bill Flounders<br>
UC Berkeley<br>
<br>
<br>
<br>
Chandrashekar S Kambar wrote:<br>
</div>
<blockquote
cite="mid:CAP+SBAofRxkw7zOVEBnnP1t+2CCP2_WZdRqvggGCSvdvsUM79w@mail.gmail.com"
type="cite">
<p>Hi,<br>
<br>
We are trying to optimize Ni with E-Beam Evaporator
(TECPORT). <br>
<br>
The E-Beam power is raised in two steps: RAISE 1, SOAK 1
AND RAISE 2, SOAK 2.<br>
ELECTRON BEAM PATTERN: Focused to one point (to the
middle of the crucible).<br>
CRUCIBLE: Graphite.<br>
<br>
ISSUE: During the RAISE 1, everything seems to be normal
and only the material in the middle of the crucible gets
melted. During the RAISE 2 the material starts to spit
out of the crucible. During the deposition the spitting
increases drastically, thus we will be forced to stop
the deposition. After the deposition when we take out
the crucible, crucible was broken across the wall.
However there was no damage done to the pocket holder
(Hearth).
<br>
<br>
Power % : Raise 1: 5% (V= 6.99 KV and I ~ 70 mA)<br>
Raise 2: 10% (V= 6.99 KV and I ~ 120 mA)<br>
During the deposition Power % goes up to
16% and the current goes up to 180 mA ( V = 6.99 KV
constant).<br>
<br>
We need to know, if there is any way to reduce the
crucible cracking and to avoid the spitting of the
material.
<br>
<br>
QUESTION 2:<br>
<br>
During the deposition the crucibles are cracked and its
pieces are stuck with the Ni material. Is there any way
to recover the material by removing the graphite pieces?</p>
<p>Thanks and Regards,<br>
Chandrashekar S Kambar.</p>
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