<html xmlns:v="urn:schemas-microsoft-com:vml" xmlns:o="urn:schemas-microsoft-com:office:office" xmlns:w="urn:schemas-microsoft-com:office:word" xmlns:m="http://schemas.microsoft.com/office/2004/12/omml" xmlns="http://www.w3.org/TR/REC-html40"><head><meta http-equiv=Content-Type content="text/html; charset=utf-8"><meta name=Generator content="Microsoft Word 14 (filtered medium)"><style><!--
/* Font Definitions */
@font-face
{font-family:Calibri;
panose-1:2 15 5 2 2 2 4 3 2 4;}
@font-face
{font-family:Tahoma;
panose-1:2 11 6 4 3 5 4 4 2 4;}
@font-face
{font-family:"Arial Black";
panose-1:2 11 10 4 2 1 2 2 2 4;}
/* Style Definitions */
p.MsoNormal, li.MsoNormal, div.MsoNormal
{margin:0cm;
margin-bottom:.0001pt;
font-size:12.0pt;
font-family:"Times New Roman","serif";}
a:link, span.MsoHyperlink
{mso-style-priority:99;
color:blue;
text-decoration:underline;}
a:visited, span.MsoHyperlinkFollowed
{mso-style-priority:99;
color:purple;
text-decoration:underline;}
span.EmailStyle17
{mso-style-type:personal-reply;
font-family:"Calibri","sans-serif";
color:#1F497D;}
.MsoChpDefault
{mso-style-type:export-only;
font-family:"Calibri","sans-serif";
mso-fareast-language:EN-US;}
@page WordSection1
{size:612.0pt 792.0pt;
margin:72.0pt 72.0pt 72.0pt 72.0pt;}
div.WordSection1
{page:WordSection1;}
--></style><!--[if gte mso 9]><xml>
<o:shapedefaults v:ext="edit" spidmax="1026" />
</xml><![endif]--><!--[if gte mso 9]><xml>
<o:shapelayout v:ext="edit">
<o:idmap v:ext="edit" data="1" />
</o:shapelayout></xml><![endif]--></head><body lang=EN-CA link=blue vlink=purple><div class=WordSection1><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Hi Kamal.<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Here at Carleton University our main annual undergrad project is a CMOS device chip. For what it worth our Aluminum evaporation system is also deposits quite a bit of gold for bio sensor type projects. We do try to keep anything that touches the substrates or source material (ie wafer holder jigs, tweezers etc) separate but the chamber and shielding itself just gets coated over and over with no special cleaning. Sodium of course is the one big contaminate we are most concerned with.<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>To my knowledge we have not have had any issues with gold contamination since we started the CMOS/NMOS process more than 15years ago.<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Though I’m not sure if the same would hold true for your ICP CVD system. Depositing a nitride or polysilicon layer would probably help.<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'>Regards<o:p></o:p></span></p><p class=MsoNormal><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'>Robert Vandusen</span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'><br></span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'>Technical Officer, Microfabrication Lab</span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'><br></span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'>Electronics Department</span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'><br></span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'>Carleton University</span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'><br></span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'>room: 4184 Mackenzie Building</span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'><br></span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'>613-520-5761</span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'><br></span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'>rvanduse@doe.carleton.ca</span><span lang=EN-US style='font-size:10.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'> <br><br></span><span style='font-size:11.0pt;font-family:"Arial Black","sans-serif";color:#1F497D'><o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><b><span lang=EN-US style='font-size:10.0pt;font-family:"Tahoma","sans-serif"'>From:</span></b><span lang=EN-US style='font-size:10.0pt;font-family:"Tahoma","sans-serif"'> labnetwork-bounces@mtl.mit.edu [mailto:labnetwork-bounces@mtl.mit.edu] <b>On Behalf Of </b>Kamal Yadav<br><b>Sent:</b> June-05-15 5:33 AM<br><b>To:</b> labnetwork@mtl.mit.edu<br><b>Subject:</b> [labnetwork] Chamber Cleaning With Gold Contamination<o:p></o:p></span></p><p class=MsoNormal><o:p> </o:p></p><div><p class=MsoNormal>Dear All,<o:p></o:p></p><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>Though may not make much sense, but would wanted to know if there are any successful cleaning procedures for chamber to remove affect of gold usage/contamination in that chamber.<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>We want to use the chamber with gold pads exposed to the plasma, but at the same time, need to allow those whose devices may get affected from gold [in CMOS]. Any intermediate cleaning/deposition that could significantly (?) reduce the affect. <o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>Our chamber [ICPCVD] has been used [5+ years] with gold pads [exposed to plasma] and so far other groups have not reported any issues with their devices, so its working out fine till now.<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>But we want to take precautionary measures if any.<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>Thanks a lot!<o:p></o:p></p></div><div><div><p class=MsoNormal><o:p> </o:p></p></div><p class=MsoNormal>-- <o:p></o:p></p><div><div><div><div><div><div><div><div><p class=MsoNormal>Thanks,<o:p></o:p></p></div><div><p class=MsoNormal>Kamal Yadav<o:p></o:p></p></div><div><p class=MsoNormal>Sr. Process Technologist<o:p></o:p></p></div><div><p class=MsoNormal>Electrical Engineering<o:p></o:p></p></div><div><p class=MsoNormal>IIT Bombay<o:p></o:p></p></div><div><p class=MsoNormal>Mobile: 7506144798<o:p></o:p></p></div></div></div></div></div></div></div></div></div></div></div></body></html>