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<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">Dear Vito,<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">I wonder what you mean with precision cleaving. We use to cleave GaN/sapphire using a classic diamond scribing tool. We do full line scribe and pass the diamond
tool several time on the sapphire side. Then we flip the wafer upside down on a rubber mat (mouse pad) and place a SS 2mm diameter rod and we push on both sides of the rod and generally increasing the pressure till it breaks.
<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">We were not interested in the shape of the cleave but and I don’t believe you can get a vertical smooth wall as the cleavage is not relying on a cleavage plan
(which is not straightforward with sapphire).<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">For precision cleaving I know Loomis industry in California developed a scriber tool for sapphire based on full line scribe followed by a roller (like Espen
described) to break the wafer. <o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">Hope this helps,<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">Fouad Karouta<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">*********************************<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">Manager ANFF ACT Node<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">Australian National Fabrication Facility<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">Research School of Physics and Engineering<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">L. Huxley Building (#56), Mills Road, Room 4.02<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">Australian National University<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">ACT 0200, Canberra, Australia<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">Tel: + 61 2 6125 7174<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">Mob: + 61 451 046 412<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D">Email:
<a href="mailto:fouad.karouta@anu.edu.au"><span style="color:blue">fouad.karouta@anu.edu.au</span></a><o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D"><a href="http://anff-act.anu.edu.au/"><span style="color:blue">http://anff-act.anu.edu.au/</span></a><o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri","sans-serif";color:#1F497D"><o:p> </o:p></span></p>
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<p class="MsoNormal"><b><span lang="EN-US" style="font-size:10.0pt;font-family:"Tahoma","sans-serif"">From:</span></b><span lang="EN-US" style="font-size:10.0pt;font-family:"Tahoma","sans-serif""> labnetwork-bounces@mtl.mit.edu [mailto:labnetwork-bounces@mtl.mit.edu]
<b>On Behalf Of </b>Espen Rogstad<br>
<b>Sent:</b> Sunday, November 8, 2015 4:17 AM<br>
<b>To:</b> Vito Logiudice<br>
<b>Cc:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> Re: [labnetwork] Sapphire substrates: precision scribe & break<o:p></o:p></span></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Hi Vito,<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">A couple of years ago we scribed and cleaved a few 2" sapphire wafers that were around 300um thick. This was done with a dynatex II scribe & break machine that I guess is around 15 years old. Had to use quite high scribing and breaking
force (I can check numbers if interested) but it worked fine. The diamond scribe tool would probably not last very long but since we only scribed a few wafers we didn't have any issues with that. Also, never checked sidewalls so don't know if they were smooth
or not... Hope this helps anyway!<br>
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<span style="font-size:13.0pt">Regards,</span><o:p></o:p></p>
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<p class="MsoNormal">Espen Rogstad<o:p></o:p></p>
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<p class="MsoNormal">Senior Engineer<o:p></o:p></p>
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<p class="MsoNormal">NTNU NanoLab<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">-------------------------<o:p></o:p></p>
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<p class="MsoNormal">Sem Sælands vei 14, K1-113<o:p></o:p></p>
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<p class="MsoNormal">NO-7491 Trondheim, Norway<o:p></o:p></p>
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<p class="MsoNormal">Tlf: +47 95285642<o:p></o:p></p>
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<p class="MsoNormal"><a href="http://www.ntnu.no/nanolab">http://www.ntnu.no/nanolab</a><o:p></o:p></p>
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<p class="MsoNormal" style="margin-bottom:12.0pt"><br>
Den 7. nov. 2015 kl. 15.17 skrev Christopher Raum <<a href="mailto:crraum@gmail.com">crraum@gmail.com</a>>:<o:p></o:p></p>
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<p class="MsoNormal" style="margin-bottom:12.0pt">Hi Vito,<o:p></o:p></p>
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<p class="MsoNormal" style="margin-bottom:12.0pt">I've had success scribing across the length of the desired cleave location and then using the length of a hex key (1 to 2 mm) to provide a fulcrum under the scribe line. Then by placing finger tips on either
side of the scribe (freshly trimmed fingernails help), push down evenly over the hex key edge. By placing a gentle but steadily increasing pressure I've been able to successfully cleave fused quartz wafers (100 to 500 um thick) this way.<o:p></o:p></p>
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<p class="MsoNormal">This technique is heavily operator dependent and not suitable for large volume, but if you just need some experimental samples prepared it's a useful technique.<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal" style="margin-bottom:12.0pt">Good luck!<o:p></o:p></p>
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<p class="MsoNormal">-Chris<br>
--<br>
Christopher Raum, PhD.<br>
R&D Engineer<br>
Experimental Cosmology Group<br>
Radio Astronomy Lab<br>
University of California, Berkeley<br>
151 LeConte Hall<br>
Berkeley, CA, 94720<br>
Work: (510) 642-7801<br>
Cell: (949) 677-1905<br>
Fax: (510) 643-5204<br>
Email: <a href="mailto:craum@berkeley.edu">craum@berkeley.edu</a><br>
Alt Email: <a href="mailto:crraum@gmail.com">crraum@gmail.com</a><o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">On Fri, Nov 6, 2015 at 10:42 AM, Vito Logiudice <<a href="mailto:vito.logiudice@uwaterloo.ca" target="_blank">vito.logiudice@uwaterloo.ca</a>> wrote:<o:p></o:p></p>
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<p class="MsoNormal"><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black">Dear Colleagues,<o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p> </o:p></span></p>
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<p class="MsoNormal"><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black">I would appreciate hearing from anyone whom might be able to share some insights on how to reliably scribe & break sapphire substrates. We’re attempting to help
out a couple of research groups here with such a requirement. <o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p> </o:p></span></p>
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<p class="MsoNormal"><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black">We’ve had success with our water-cooled dicing saw but it appears this approach leads to unacceptable materials issues. We thus find ourselves having to resort
to some sort of precision (& repeatable) scribe and break technique/setup which will result in consistently smooth sidewalls.<o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p> </o:p></span></p>
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<p class="MsoNormal"><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black">Thank you for any insights on procedures you may be using or equipment vendors you have worked with whom might be able to help.<o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p> </o:p></span></p>
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<p class="MsoNormal"><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black">Best regards,<o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black">Vito <o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.5pt;font-family:"Calibri","sans-serif";color:black">--</span><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.5pt;font-family:"Calibri","sans-serif";color:black">Vito Logiudice P.Eng.</span><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.5pt;font-family:"Calibri","sans-serif";color:black">Director of Operations, Quantum NanoFab</span><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.5pt;font-family:"Calibri","sans-serif";color:black">University of Waterloo</span><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.5pt;font-family:"Calibri","sans-serif";color:black">Lazaridis QNC 1207</span><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.5pt;font-family:"Calibri","sans-serif";color:black">200 University Avenue West</span><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.5pt;font-family:"Calibri","sans-serif";color:black">Waterloo, ON Canada N2L 3G1</span><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.5pt;font-family:"Calibri","sans-serif";color:black">Tel.:
<a href="tel:%28519%29%20888-4567%20%C2%A0ext.%2038703" target="_blank">(519) 888-4567 ext. 38703</a></span><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.5pt;font-family:"Calibri","sans-serif";color:black">Email: <a href="mailto:vito.logiudice@uwaterloo.ca" target="_blank">vito.logiudice@uwaterloo.ca</a></span><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.5pt;font-family:"Calibri","sans-serif";color:black">Website: </span><span style="font-size:11.5pt;font-family:"Calibri","sans-serif";color:black"><a href="https://fab.qnc.uwaterloo.ca" target="_blank">https://fab.qnc.uwaterloo.ca</a><o:p></o:p></span></p>
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