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</o:shapelayout></xml><![endif]--></head><body lang=EN-US link="#0563C1" vlink="#954F72"><div class=WordSection1><p class=MsoNormal><span style='color:#1F497D'>Hi Julia,<o:p></o:p></span></p><p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='color:#1F497D'>I would like to echo your comments regarding UGIM. As a first time attendee, it was great to meet everyone. The University of Utah team really did an outstanding job hosting everyone. I also want to thank you and the rest of the Steering Committee for your fantastic efforts.<o:p></o:p></span></p><p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='color:#1F497D'>In regards to your issue with PDMS, we do allow it in some of our vacuum tools, but not others. We tend to keep it out of tools that have sensitive processes/materials or chambers that are harder to clean (this is a precaution in the event outgassing and contamination does occur despite have procedures in place to avoid it). However, the real key in my opinion is to minimize the chance for uncured PDMS or high temperatures to cause outgassing. Before a user is allowed to put PDMS in a tool, we request information about PDMS mixing ratio and curing procedures. Our main concern is that improper mixing and/or curing will result in residual uncured PDMS that will outgas into the chamber. Typically we see mixing ratios of 10:1 (PDMS : curing agent). If the mixing ratio is too high (say 20:1), there is a greater chance uncured PDMS will cause problems. We also prefer that users cure the PDMS with heat (80-120C) rather than relying on room temperature curing. Once approved, we also limit and monitor the sputtering recipes, allowing only low power DC magnetron depositions to minimize the heat generated during sputtering. With these procedures in place, we have had good success with deposition of Al, Au, and several other metals. <o:p></o:p></span></p><p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='color:#1F497D'>I believe the answer to your second question really depends on the size and structure of the fab. A little over one year ago our structure changed to now include a Faculty Director, Executive Manager (me), Equipment Manager, 2 Process Engineers, and 2 Technicians. We have approximately 180 users (internal and external) per year, and the vast majority of our users come into the fab and perform their own work. Given our user base, I feel that our current structure works well. From various conversations and sessions at UGIM, I understand that your fab has been moving more towards fee-for-service work. As that work grows, I could see where it may become more important to have a business manager that handles contracts, outreach, invoicing, billing, etc., while a technical manager ensures the fab can produce and sustain the processes that make the fee-for-service work, research, and cleanroom a success. Just my 2 cents. <o:p></o:p></span></p><p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='color:#1F497D'>Best Regards,<o:p></o:p></span></p><p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='color:#1F497D'>Matt<o:p></o:p></span></p><p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p><div><p class=MsoNormal><span style='color:#1F497D'>-- <br><b>Matthew T. Moneck, Ph.D.</b><br>Executive Manager, Carnegie Mellon Nanofabrication Facility<br>Electrical and Computer Engineering | Carnegie Mellon University<br>5000 Forbes Ave., Pittsburgh, PA 15213-3890<br>T: 412.268.5430<br>F: 412.268.3497<br><a href="http://www.ece.cmu.edu"><span style='color:blue'>www.ece.cmu.edu</span></a><br>nanofab.ece.cmu.edu<o:p></o:p></span></p></div><p class=MsoNormal><span style='color:#1F497D'><o:p> </o:p></span></p><div><div style='border:none;border-top:solid #E1E1E1 1.0pt;padding:3.0pt 0in 0in 0in'><p class=MsoNormal><b>From:</b> labnetwork-bounces@mtl.mit.edu [mailto:labnetwork-bounces@mtl.mit.edu] <b>On Behalf Of </b>julia.aebersold@louisville.edu<br><b>Sent:</b> Friday, June 17, 2016 6:22 PM<br><b>To:</b> labnetwork@mtl.mit.edu<br><b>Subject:</b> [labnetwork] PDMS in sputtering tool<o:p></o:p></p></div></div><p class=MsoNormal><o:p> </o:p></p><div><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>Greetings everyone! I had a great time at UGIM and enjoyed seeing old friends and making new acquaintances. The University of Utah hospitality was fantastic. I do have some questions. <o:p></o:p></span></p><div><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'><o:p> </o:p></span></p></div><div><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>1. We have had an aluminum adhesion issue with bubbling under the deposited film. We have had a user put their PDMS devices into our sputtering tool and have been told that outgasing PDMS could be the source of our bubbling underneath aluminum. We do not see this behavior with other metal depositions. Do you ban PDMS from your processing chambers? Also, we will go ahead with decontamination using sand blasting and solvent wipe downs, but do you recommend other processes (i.e. chemical dips for parts that can be removed)?<o:p></o:p></span></p></div><div><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'><o:p> </o:p></span></p></div><div><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>2. My second question revolves around organizational structure. We currently have a Faculty Director, Cleanroom Manager (me), 3 Engineers and 1 Admin. Structures and the number of people in facilties vary immensely due to size of the facility, but I wanted to know how many split their cleanroom manager position into a technical manager and business operations manager. The business operations manager would primarily handle administrative tasks and rarely step foot into the cleanroom.<o:p></o:p></span></p><div><p class=MsoNormal><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'><o:p> </o:p></span></p><div><div><div><div><div><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>Cheers!<o:p></o:p></span></p><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'><o:p> </o:p></span></p><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>Julia Aebersold, Ph.D.<o:p></o:p></span></p><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>MNTC Cleanroom Manager<o:p></o:p></span></p><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>University of Louisville<o:p></o:p></span></p><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>2210 South Brook Street<o:p></o:p></span></p><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>Shumaker Research Building, Room 233<o:p></o:p></span></p><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>Louisville, KY 40292<o:p></o:p></span></p><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'> <o:p></o:p></span></p><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'>(502) 852-1572<o:p></o:p></span></p><p><span style='font-size:10.0pt;font-family:"Tahoma",sans-serif;color:black'><a href="http://louisville.edu/micronano">http://louisville.edu/micronano/</a><o:p></o:p></span></p></div></div></div></div></div></div></div></div></div></body></html>