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</o:shapelayout></xml><![endif]--></head><body lang=EN-US link=blue vlink=purple><div class=WordSection1><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'>Hi Michael,<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'>It was great meeting you at UGIM. We’ve had our fair share of issues sputtering NiFe in the past. With NiFe being such a high permeability material, the issues we typically see revolve around low pass through flux (i.e. too much shunting of magnetic field through the target) as a result of the NiFe target being too thick and/or cathode magnets being too weak (we typically use NdFeB). We have even gone as far as to cut an erosion groove in one of our NiFe targets (it was too thick when ordered) to increase the pass through flux enough to trap electrons at the target. However, in the above scenarios, we would have a situation where the plasma would only ignite at high pressure or not ignite at all. In those cases, we either need to run RF (typically results in high reflected power) or make a change to the target and/or cathode. <o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'>Your case is obviously a bit different as it seems that you can run the plasma for a few runs before it fails. We have seen similar failure mechanisms, but they can be caused by many factors. Are your burn-in runs done at a different pressure and DC power than the 800 W runs that are failing? Also, are the failed runs always right after a conditioning run or burn-in run? Furthermore, have you had a chance to inspect the target and shields for buildup of material (we have seen intermittent shorts that only occur after sputtering for some time)? More recently, we even had a magnetic target (CoFeB) crack and subsequently display the type of behavior you are seeing.<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'>If you need a run for your client, we are set up to do NiFe and can handle wafers up to 6” diameter. We would only need to know what type of substrate as well as the requirements for film properties (thickness, stress, coercivity, need for easy axis, etc.). My only concern is that it may take several days to get a contract in place. I will forward the agreement to you in a separate email if you are interested in pursuing this further. <o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'>Best Regards,<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'><o:p> </o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'>Matt<o:p></o:p></span></p><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'><o:p> </o:p></span></p><div><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'>-- <br><b>Matthew T. Moneck, Ph.D.</b><br>Executive Manager, Carnegie Mellon Nanofabrication Facility<br>Electrical and Computer Engineering | Carnegie Mellon University<br>5000 Forbes Ave., Pittsburgh, PA 15213-3890<br>T: 412.268.5430<br>F: 412.268.3497<br><a href="http://www.ece.cmu.edu">www.ece.cmu.edu</a><br>nanofab.ece.cmu.edu<o:p></o:p></span></p></div><p class=MsoNormal><span style='font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D'><o:p> </o:p></span></p><div><div style='border:none;border-top:solid #E1E1E1 1.0pt;padding:3.0pt 0in 0in 0in'><p class=MsoNormal><b><span style='font-size:11.0pt;font-family:"Calibri",sans-serif'>From:</span></b><span style='font-size:11.0pt;font-family:"Calibri",sans-serif'> labnetwork-bounces@mtl.mit.edu [mailto:labnetwork-bounces@mtl.mit.edu] <b>On Behalf Of </b>Michael Khbeis<br><b>Sent:</b> Sunday, June 19, 2016 12:40 AM<br><b>To:</b> labnetwork@mtl.mit.edu<br><b>Subject:</b> [labnetwork] NiFe 81-19 Sputtering Request<o:p></o:p></span></p></div></div><p class=MsoNormal><o:p> </o:p></p><div><p class=MsoNormal>Dear Colleagues<o:p></o:p></p></div><div id=AppleMailSignature><p class=MsoNormal><o:p> </o:p></p></div><div id=AppleMailSignature><p class=MsoNormal>We have an issue sputtering NiFe in our Lesker PVD75. The target runs fine for burn-in and a few runs but then can't maintain a plasma (DC 800W). <o:p></o:p></p></div><div id=AppleMailSignature><p class=MsoNormal><o:p> </o:p></p></div><div id=AppleMailSignature><p class=MsoNormal>Does anyone have an idea what causes relatively rapid failure in maintaining plasma with this specific material? I doubt the target is worn that fast. <o:p></o:p></p></div><div id=AppleMailSignature><p class=MsoNormal><o:p> </o:p></p></div><div id=AppleMailSignature><p class=MsoNormal>Also, we have a client that urgently needs some depositions. Is there a site willing to take on the task while we troubleshoot our system?<o:p></o:p></p></div><div id=AppleMailSignature><p class=MsoNormal><o:p> </o:p></p></div><div id=AppleMailSignature><p class=MsoNormal style='margin-bottom:12.0pt'>Gratefully,<o:p></o:p></p><div><p class=MsoNormal>Dr. Michael Khbeis<o:p></o:p></p><div><p class=MsoNormal>Washington Nanofab Facility<br>University of Washington<br>Fluke Hall, Box 352143<br>(O) <a href="tel:206.543.5101">206.543.5101</a><br>(C) <a href="tel:443.254.5192">443.254.5192</a><br><a href="mailto:khbeis@uw.edu">khbeis@uw.edu</a><o:p></o:p></p></div></div></div></div></body></html>