<html><head><meta http-equiv="Content-Type" content="text/html charset=windows-1252"></head><body style="word-wrap: break-word; -webkit-nbsp-mode: space; -webkit-line-break: after-white-space;" class="">We’ll try the arc-spray coating from Pentagon Technologies and keep the other advice in mind. Thanks everyone!<div class=""><br class=""></div><div class="">--Long</div><div class=""><div><blockquote type="cite" class=""><div class="">On Oct 12, 2016, at 3:33 PM, Gerhard Ulbricht <<a href="mailto:ulbricht@physics.ucsb.edu" class="">ulbricht@physics.ucsb.edu</a>> wrote:</div><br class="Apple-interchange-newline"><div class="">
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Sputtering at lower power will produce less heat and thermal stress
and can delay flaking, but flakes will still show up when the film
deposited on your sputter chimney and shutter gets thicker. <br class="">
<br class="">
What we do for materials that are very prone to flaking (e.g. RF
sputtered Si or DC sputtered W) is to send out chimney and shutter
to get their insides arc-spray coated with a very rough and thick Al
layer - about the surface structure of extra coarse sand paper. That
for us has stopped Si flaking completely, in contrast to having to
clean the sputter gun from flakes every 2 weeks. We have to get
these parts re-coated every time we change a sputter target, but the
company (Pentagon Technologies) does both the bead blasting and the
new coating for us (what is very convenient), and it's not
expensive.<br class="">
<br class="">
Best regards,<br class="">
<br class="">
Gerhard Ulbricht<br class="">
Department of Physics<br class="">
Broida Hall<br class="">
University of California<br class="">
Santa Barbara CA 93106<br class="">
<br class="">
<br class="">
<br class="">
<div class="moz-cite-prefix">On 10/11/2016 4:24 PM, Chang, Long
wrote:<br class="">
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<blockquote cite="mid:406F6B69-5D08-45CD-9D79-AB9A60A314F7@central.uh.edu" type="cite" class="">
Hi All,
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<div class="">We have a DC magnetron sputtering system using 2”
diameter targets. We’ve been observing many shorts due to
severe flaking. The student is using a recipe developed by her
predecessor which uses 100W of DC power and 5 mTorr of Ar. Does
anyone know what steps should be taken to avoid/reduce flaking
when DC sputtering ITO? I suspect that the student is using too
much power.</div>
<div class=""><br class="">
</div>
<div class="">Thanks,</div>
<div class=""><span style="orphans: 2; text-align: -webkit-auto;
widows: 2;" class="">Long Chang</span></div>
<div class="">
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<div class="">
<div class="">Nanofab Manager</div>
<div class="">
<div class="">University of Houston</div>
<div class="">3605 Cullen Blvd, Entrance 14</div>
<div class="">Room E1007A, SERC Bldg 545</div>
<div class="">Houston, TX 77204-5062</div>
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