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<p class="MsoNormal"><a name="_MailEndCompose"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:windowtext">Long Chang,<o:p></o:p></span></a></p>
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<p class="MsoNormal"><span style="mso-bookmark:_MailEndCompose"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:windowtext">I used to Sputter at low power. I usually start at 15W 2mTorr 10 SCCM of Ar, slowly ramp to 50W but not more than
50W. Sometimes ITO target cracks at high power and to avoid this I usually tell users to go at low power. I usually check the sputtering shield,chimney, shutter once a week for the flakes.
<o:p></o:p></span></span></p>
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<p class="MsoNormal"><span style="mso-bookmark:_MailEndCompose"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:windowtext">-Regards<o:p></o:p></span></span></p>
<p class="MsoNormal"><span style="mso-bookmark:_MailEndCompose"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:windowtext">-Shiva<o:p></o:p></span></span></p>
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<p class="MsoNormal"><span style="mso-bookmark:_MailEndCompose"><span style="font-size:10.0pt;color:#1F4E79;background:white">Shivakumar Bhaskaran, Ph.D.,<o:p></o:p></span></span></p>
<p class="MsoNormal"><span style="mso-bookmark:_MailEndCompose"><span style="font-size:10.0pt;color:#1F4E79;background:white">Research and Development Scientist and Engineer</span></span><span style="mso-bookmark:_MailEndCompose"><span style="font-size:10.0pt;color:#1F4E79">,
<o:p></o:p></span></span></p>
<p class="MsoNormal"><span style="mso-bookmark:_MailEndCompose"><span style="font-size:10.0pt;color:#1F4E79">National Nanotechnology Coordinated Infrastructure (NNCI),<o:p></o:p></span></span></p>
<p class="MsoNormal"><span style="mso-bookmark:_MailEndCompose"><span style="font-size:10.0pt;color:#1F4E79;background:white">Stanford University, 348 Via Pueblo, Spilker Building,Room 004, Stanford, CA 94305.
<o:p></o:p></span></span></p>
<p class="MsoNormal"><span style="mso-bookmark:_MailEndCompose"><span style="font-size:10.0pt;color:#1F4E79;background:white">Ph:650-498-5653<o:p></o:p></span></span></p>
<p class="MsoNormal"><span style="mso-bookmark:_MailEndCompose"></span><a href="http://nanolabs.stanford.edu/"><span style="mso-bookmark:_MailEndCompose"><span style="font-size:10.0pt;color:#1F4E79">http://nanolabs.stanford.edu</span></span><span style="mso-bookmark:_MailEndCompose"></span></a><span style="mso-bookmark:_MailEndCompose"><span style="font-size:10.0pt;color:#1F4E79"><o:p></o:p></span></span></p>
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<p class="MsoNormal"><span style="mso-bookmark:_MailEndCompose"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:windowtext"><o:p> </o:p></span></span></p>
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<p class="MsoNormal"><b><span style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:windowtext">From:</span></b><span style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:windowtext"> labnetwork-bounces@mtl.mit.edu [mailto:labnetwork-bounces@mtl.mit.edu]
<b>On Behalf Of </b>Gerhard Ulbricht<br>
<b>Sent:</b> Wednesday, October 12, 2016 1:34 PM<br>
<b>To:</b> Chang, Long <lvchang@Central.UH.EDU><br>
<b>Cc:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> Re: [labnetwork] DC sputtering of ITO<o:p></o:p></span></p>
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<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal" style="margin-bottom:12.0pt">Sputtering at lower power will produce less heat and thermal stress and can delay flaking, but flakes will still show up when the film deposited on your sputter chimney and shutter gets thicker.
<br>
<br>
What we do for materials that are very prone to flaking (e.g. RF sputtered Si or DC sputtered W) is to send out chimney and shutter to get their insides arc-spray coated with a very rough and thick Al layer - about the surface structure of extra coarse sand
paper. That for us has stopped Si flaking completely, in contrast to having to clean the sputter gun from flakes every 2 weeks. We have to get these parts re-coated every time we change a sputter target, but the company (Pentagon Technologies) does both the
bead blasting and the new coating for us (what is very convenient), and it's not expensive.<br>
<br>
Best regards,<br>
<br>
Gerhard Ulbricht<br>
Department of Physics<br>
Broida Hall<br>
University of California<br>
Santa Barbara CA 93106<br>
<br>
<br>
<o:p></o:p></p>
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<p class="MsoNormal">On 10/11/2016 4:24 PM, Chang, Long wrote:<o:p></o:p></p>
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<p class="MsoNormal">Hi All, <o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">We have a DC magnetron sputtering system using 2” diameter targets. We’ve been observing many shorts due to severe flaking. The student is using a recipe developed by her predecessor which uses 100W of DC power and 5 mTorr of Ar. Does
anyone know what steps should be taken to avoid/reduce flaking when DC sputtering ITO? I suspect that the student is using too much power.<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Thanks,<o:p></o:p></p>
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<p class="MsoNormal">Long Chang<o:p></o:p></p>
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<p class="MsoNormal"><span style="font-family:"Helvetica",sans-serif">Nanofab Manager<o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-family:"Helvetica",sans-serif">University of Houston<o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-family:"Helvetica",sans-serif">3605 Cullen Blvd, Entrance 14<o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-family:"Helvetica",sans-serif">Room E1007A, SERC Bldg 545<o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-family:"Helvetica",sans-serif">Houston, TX 77204-5062<o:p></o:p></span></p>
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<p class="MsoNormal"><br>
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<o:p></o:p></p>
<pre>_______________________________________________<o:p></o:p></pre>
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