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<p class="MsoNormal">Dear Colleagues,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Recently, we got a request to deposit SiO2 and Ag in our e-beam evaporator. We have only one e-beam UHV evaporator (brand new) which we planned to dedicate for metals (only). From what was discussed the group is planning to deposit alternative
layers of SiO2 and Ag (10-20nm thick) to ~1micron thick overall thickness. <o:p>
</o:p></p>
<p class="MsoNormal">Did anyone have experience with similar multilayer structures, would you advise me if e-beam evaporation or sputtering would better for this project?<o:p></o:p></p>
<p class="MsoNormal">If we will have to go with evaporation of SiO2, will it have contamination issues with metal deposition?<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Thanks for advice, Esta<o:p></o:p></p>
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<p class="MsoNormal"><span style="font-size:9.0pt;font-family:Atlanta">-----------------------</span><o:p></o:p></p>
<p class="MsoNormal"><b><span style="font-size:9.0pt;font-family:Atlanta">Esta Abelev, PhD</span></b><o:p></o:p></p>
<p class="MsoNormal"><span style="font-size:9.0pt;font-family:Atlanta">Technical Director,<i> </i>Petersen Institute of NanoScience and Engineering </span><o:p></o:p></p>
<p class="MsoNormal"><span style="font-size:9.0pt;font-family:Atlanta">University of Pittsburgh | 3700 O’Hara Street | 636| Pittsburgh, PA 15261</span><o:p></o:p></p>
<p class="MsoNormal"><span style="font-size:9.0pt;font-family:Atlanta">412-383-4096 | <a href="mailto:eabelev@pitt.edu"><span style="color:#0066CC;text-decoration:none">eabelev@pitt.edu</span></a> | <a href="https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0"><span style="color:purple;text-decoration:none">nano.pitt.edu</span></a></span><o:p></o:p></p>
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