<div dir="ltr"><div><div><div><div><div>Hi Esta,<br></div>We both sputter and evaporate the SiO2 in our shared tools. <br><br></div>I have two users who do a single layer of Ag/SiO2 (~1KA each) but I don't know anyone who does multi-layer stacks on my current tool but we had an older tool where it was done years ago. The biggest issues have been pointed out already: it doesn't stick as well to the QCM (you can try a new crystal and Ti coat just the crystal if you want), it can get in the system (but I don't find it too unstable or harmful to the vacuum,) multiple coatings can screw up your ion/pirani gauge readings (that is more an issues with Al2O3, TiO2 in my tool.) <br><br></div>Evap vs sputtering: If you are looking at RF off an SiO2 target, the sputtering rates are going to be slow (reactive will be faster, not sure if you can pulse-dc it or not.) The sputtered film will be denser and less likely to be as pinholed. In terms of evap, you get the less dense film but higher dep rate. Depending on your crucible size, I am not sure about your max thickness - since the SiO2 sublimates, 1um ebeam of SiO2 may be difficult, even with a broad sweep.<br><br></div>Hope that helps,<br></div> -Matt<br></div><div class="gmail_extra"><br clear="all"><div><div class="gmail_signature" data-smartmail="gmail_signature"><div>Matthew Oonk</div><div>Research Engineer</div><div>Lurie Nanofabrication Facility</div><div>University of Michigan </div><div>734-646-1275</div><div><a href="mailto:mwoonk@umich.edu" target="_blank">mwoonk@umich.edu</a></div></div></div>
<br><div class="gmail_quote">On Mon, Jul 31, 2017 at 8:09 PM, Abelev, Esta <span dir="ltr"><<a href="mailto:eabelev@pitt.edu" target="_blank">eabelev@pitt.edu</a>></span> wrote:<br><blockquote class="gmail_quote" style="margin:0 0 0 .8ex;border-left:1px #ccc solid;padding-left:1ex">
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<p class="MsoNormal">Dear Colleagues,<u></u><u></u></p>
<p class="MsoNormal"><u></u> <u></u></p>
<p class="MsoNormal">Recently, we got a request to deposit SiO2 and Ag in our e-beam evaporator. We have only one e-beam UHV evaporator (brand new) which we planned to dedicate for metals (only). From what was discussed the group is planning to deposit alternative
layers of SiO2 and Ag (10-20nm thick) to ~1micron thick overall thickness. <u></u>
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<p class="MsoNormal">Did anyone have experience with similar multilayer structures, would you advise me if e-beam evaporation or sputtering would better for this project?<u></u><u></u></p>
<p class="MsoNormal">If we will have to go with evaporation of SiO2, will it have contamination issues with metal deposition?<u></u><u></u></p>
<p class="MsoNormal"><u></u> <u></u></p>
<p class="MsoNormal">Thanks for advice, Esta<u></u><u></u></p>
<p class="MsoNormal"><u></u> <u></u></p>
<p class="MsoNormal"><span style="font-size:9.0pt;font-family:Atlanta">-----------------------</span><u></u><u></u></p>
<p class="MsoNormal"><b><span style="font-size:9.0pt;font-family:Atlanta">Esta Abelev, PhD</span></b><u></u><u></u></p>
<p class="MsoNormal"><span style="font-size:9.0pt;font-family:Atlanta">Technical Director,<i> </i>Petersen Institute of NanoScience and Engineering </span><u></u><u></u></p>
<p class="MsoNormal"><span style="font-size:9.0pt;font-family:Atlanta">University of Pittsburgh | 3700 O’Hara Street | 636| Pittsburgh, PA 15261</span><u></u><u></u></p>
<p class="MsoNormal"><span style="font-size:9.0pt;font-family:Atlanta"><a href="tel:(412)%20383-4096" value="+14123834096" target="_blank">412-383-4096</a> | <a href="mailto:eabelev@pitt.edu" target="_blank"><span style="color:#0066cc;text-decoration:none">eabelev@pitt.edu</span></a> | <a href="https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0" target="_blank"><span style="color:purple;text-decoration:none">nano.<wbr>pitt.edu</span></a></span><u></u><u></u></p>
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