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Keeping the wafers wet, as Chito said, is key. I used to work with
lab members who had good results using solid PVA foam sponges to
remove tough CMP slurry from delicate wafers. The foam is quite soft
when wet but traps the small particles effectively without causing
further damage.<br>
<br>
Good luck!<br>
<br>
<div class="moz-cite-prefix">On 8/15/2017 4:53 PM, Chito Kendrick
wrote:<br>
</div>
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<div>
<div style="font-family: Calibri,sans-serif; font-size: 11pt;">Can
you apply a coating before dicing? I normally have old 1827
around that users can use as a pre-dice coating. Also never
let the samples dry out before rinsing and then removing the
1827 in acetone.<br>
<br>
Chito Kendrick </div>
</div>
<div dir="ltr">
<hr><span style="font-family: Calibri,sans-serif; font-size:
11pt; font-weight: bold;">From: </span><span
style="font-family: Calibri,sans-serif; font-size: 11pt;"><a
href="mailto:fgavin@wafabintl.com" moz-do-not-send="true">Gavin,
Frank</a></span><br>
<span style="font-family: Calibri,sans-serif; font-size: 11pt;
font-weight: bold;">Sent: </span><span style="font-family:
Calibri,sans-serif; font-size: 11pt;">8/15/2017 19:33</span><br>
<span style="font-family: Calibri,sans-serif; font-size: 11pt;
font-weight: bold;">To: </span><span style="font-family:
Calibri,sans-serif; font-size: 11pt;"><a
href="mailto:labnetwork@mtl.mit.edu" moz-do-not-send="true">labnetwork@mtl.mit.edu</a></span><br>
<span style="font-family: Calibri,sans-serif; font-size: 11pt;
font-weight: bold;">Subject: </span><span style="font-family:
Calibri,sans-serif; font-size: 11pt;">[labnetwork] Looking for
cleaning advice - post wire-saw - removingslurry from wafers</span><br>
<br>
</div>
<div class="WordSection1">
<p class="MsoNormal">I am looking for a process to clean post
wire sawing Silicon Carbide substrates. The material being
cleaning is SiC substrates and the abrasive that needs to be
removed is a synthetic glycol based fluid mixed with diamond
powder. During the wire sawing process there is also kerf
from the SiC as well as the steel cord wire that abrades as
well. It is a very aggressive process and heavy solids need
to be removed. Operators are spending the day hand wiping
wafers. Any advice is welcomed.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal"><span style="color: rgb(31, 73, 125);">Best
Regards,</span><o:p></o:p></p>
<p class="MsoNormal"><span style="color: rgb(31, 73, 125);">FRANK
GAVIN, Sales Eng.</span><o:p></o:p></p>
<p class="MsoNormal"><a href="http://www.wafabintl.com/"
moz-do-not-send="true"><span style="color: windowtext;
text-decoration: none;"><img id="Picture_x0020_1"
style="width: 2.083in; height: 0.635in;"
alt="WaFab_Logo200px"
src="cid:image001.png@01D315CF.B4022790"
moz-do-not-send="true" height="61" width="200"
border="0"></span></a><o:p></o:p></p>
<p class="MsoNormal"><span style="color: rgb(9, 47, 135);
font-size: 10pt;">6161 Industrial Way, Livermore CA 94551<br>
<b>(925) 455-5252 ext 2420</b> Fax: (925) 455-5351</span><span
style="color: black; font-size: 10pt;"><br>
<br>
</span><o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
</div>
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<pre class="moz-signature" cols="72">--
Carsen Kline
Lab Operations Manager
Stanford Nanofabrication Facility
Paul G. Allen Bldg 131
Stanford, CA 94305
(650)724-8214
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