<div dir="ltr">We are following the manufacturer's recommendation for processing, but not doing EBR. This is taken into consideration during measurement however. We don't have edge bead or uniformity issues if we use dry film.<div>Nic</div></div><div class="gmail_extra"><br><div class="gmail_quote">On Wed, Aug 16, 2017 at 5:39 PM, Chito Kendrick <span dir="ltr"><<a href="mailto:cekendri@mtu.edu" target="_blank">cekendri@mtu.edu</a>></span> wrote:<br><blockquote class="gmail_quote" style="margin:0 0 0 .8ex;border-left:1px #ccc solid;padding-left:1ex">
<div bgcolor="#FFFFFF" text="#000000">
<p>Can you add how you are applying the SU-8 and does your
calculation include the edge bead or are you using an edge bead
remover.</p>
<p>I am also interested in this as I have a biochip company work in
my lab that is try to get an edge bead free film without just
cutting it off as they are losing to many devices in there mind.
Currently, been looking at using a screen printer and also there
was a paper on spraying edge bead remover on the SU-8 after
spinning to get a edge bead free film.</p>
<p>Chito Kendrick<br>
</p><div><div class="h5">
<br>
<div class="m_2371699881318770911moz-cite-prefix">On 8/16/2017 3:55 PM, John Sam Soon
wrote:<br>
</div>
</div></div><blockquote type="cite"><div><div class="h5">
<div dir="ltr">Hello<br>
<div>We've been running uniformity thickness tests of SU8-2025
on 4 in prime Si wafers (measured with a mechanical
profilometer), and have gotten results around 13%
(Max-Min/(Max+min)). Far from Microchem's reported 5%). I
wanted to reach out to the community as to:</div>
<div>
<div>1) What are some of the uniformity numbers that other
users are getting? and</div>
<div>2) for those getting good uniformity, are there any
process control tips that can be shared?</div>
<div><br>
</div>
<div><br>
</div>
<div>-- <br>
<div class="m_2371699881318770911gmail-m_-2768700391886273260gmail_signature">
<div dir="ltr">
<div dir="ltr">
<div dir="ltr">Nicholas Sam-Soon<br>
Microfabrication Process Engineer
<div>Calit2 Qualcomm Institute<br>
UC San Diego<br>
</div>
<div><a href="http://nano3.calit2.net/" target="_blank">http://nano3.calit2.net/</a></div>
Email: <a href="mailto:jsamsoon@ucsd.edu" target="_blank">jsamsoon@ucsd.edu</a></div>
<div><br>
</div>
</div>
</div>
</div>
</div>
</div>
</div>
<br>
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<br>
<div class="m_2371699881318770911moz-signature">-- <br>
<a href="https://sites.google.com/site/chitokendrickphd/" target="_blank">Chito
Kendrick Ph.D.</a><br>
<br>
Managing Director of the Microfabrication Facility<br>
Research Assistant Professor<br>
Electrical and Computer Engineering<br>
Michigan Technological University<br>
Room 436 M&M Building<br>
1400 Townsend Dr.<br>
Houghton, Michigan 49931-1295<br>
<br>
<a href="tel:(814)%20308-4255" value="+18143084255" target="_blank">814-308-4255</a><br>
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<br></blockquote></div><br><br clear="all"><div><br></div>-- <br><div class="gmail_signature" data-smartmail="gmail_signature"><div dir="ltr"><div><div dir="ltr"><div><div dir="ltr">Nicholas Sam-Soon<br>Microfabrication Process Engineer<div><br>Calit2 Qualcomm Institute<br>UC San Diego<br></div><div><a href="http://nano3.calit2.net/" target="_blank">http://nano3.calit2.net/</a></div>Email: <a href="mailto:jsamsoon@ucsd.edu" target="_blank">jsamsoon@ucsd.edu</a></div><div>Phone: (714) 248-6050</div></div></div></div></div></div>
</div>