<html><head><meta http-equiv="Content-Type" content="text/html charset=us-ascii"></head><body style="word-wrap: break-word; -webkit-nbsp-mode: space; -webkit-line-break: after-white-space;" class="">We use sputtered Au/Pd exclusively here as a charge dissipation layer and have not seen any adverse effects. Our system for this is a very basic tabletop coater system that runs on 120V and takes maybe 2 minutes of sputtering to get a sufficient coating for our cases. Perhaps power/duration are important to consider.<div class=""><br class=""><div class="">
<div style="color: rgb(0, 0, 0); letter-spacing: normal; orphans: auto; text-align: start; text-indent: 0px; text-transform: none; white-space: normal; widows: auto; word-spacing: 0px; -webkit-text-stroke-width: 0px; word-wrap: break-word; -webkit-nbsp-mode: space; -webkit-line-break: after-white-space;" class=""><div style="color: rgb(0, 0, 0); letter-spacing: normal; orphans: auto; text-align: start; text-indent: 0px; text-transform: none; white-space: normal; widows: auto; word-spacing: 0px; -webkit-text-stroke-width: 0px; word-wrap: break-word; -webkit-nbsp-mode: space; -webkit-line-break: after-white-space;" class=""><div style="color: rgb(0, 0, 0); letter-spacing: normal; orphans: auto; text-align: start; text-indent: 0px; text-transform: none; white-space: normal; widows: auto; word-spacing: 0px; -webkit-text-stroke-width: 0px; word-wrap: break-word; -webkit-nbsp-mode: space; -webkit-line-break: after-white-space;" class=""><div style="color: rgb(0, 0, 0); letter-spacing: normal; orphans: auto; text-align: start; text-indent: 0px; text-transform: none; white-space: normal; widows: auto; word-spacing: 0px; -webkit-text-stroke-width: 0px; word-wrap: break-word; -webkit-nbsp-mode: space; -webkit-line-break: after-white-space;" class=""><div class=""><div class="">N. Shane Patrick<br class="">Research Engineer, Washington Nanofabrication Facility (WNF) <br class="">National Nanotechnology Coordinated Infrastructure (NNCI)<br class="">University of Washington<br class="">Fluke Hall 132, Box 352143</div><div class="">(206) 221-1045</div><div class=""><a href="mailto:patricns@uw.edu" class="">patricns@uw.edu</a></div><div class=""><a href="http://www.wnf.washington.edu/" class="">http://www.wnf.washington.edu/</a></div></div></div></div></div></div>
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<br class=""><div><blockquote type="cite" class=""><div class="">On Aug 24, 2017, at 10:50 AM, Ryan Anderson <<a href="mailto:ryan@eng.ucsd.edu" class="">ryan@eng.ucsd.edu</a>> wrote:</div><br class="Apple-interchange-newline"><div class=""><div class="">Hi all,<br class=""><br class="">We have also observed adverse effects on PMMA exposure (100kV) after<br class="">sputter coating gold. Since then we have used thermal evaporation.<br class=""><br class="">Ryan Anderson<br class="">UC San Diego, Nano3<br class=""><br class=""><br class="">-----Original Message-----<br class="">From: <a href="mailto:labnetwork-bounces@mtl.mit.edu" class="">labnetwork-bounces@mtl.mit.edu</a><br class="">[<a href="mailto:labnetwork-bounces@mtl.mit.edu" class="">mailto:labnetwork-bounces@mtl.mit.edu</a>] On Behalf Of Fouad Karouta<br class="">Sent: Wednesday, August 23, 2017 4:15 PM<br class="">To: Marc Zuiddam - TNW <<a href="mailto:M.R.Zuiddam@tudelft.nl" class="">M.R.Zuiddam@tudelft.nl</a>>; '<a href="mailto:labnetwork@mtl.mit.edu" class="">labnetwork@mtl.mit.edu</a>'<br class=""><<a href="mailto:labnetwork@mtl.mit.edu" class="">labnetwork@mtl.mit.edu</a>><br class="">Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class=""><br class="">Dear Marc,<br class=""><br class="">Evaporating Au on PMMA or ZEP should be done in a thermal evaporator, an<br class="">e-beam evaporator due to the electron beam would affect the resist. We<br class="">also avoid sputtering for this application as the effect of Ar plasma<br class="">(violet colour) can be unpredictable.<br class=""><br class="">Regards, Fouad<br class=""><br class="">-----Original Message-----<br class="">From: <a href="mailto:labnetwork-bounces@mtl.mit.edu" class="">labnetwork-bounces@mtl.mit.edu</a><br class="">[<a href="mailto:labnetwork-bounces@mtl.mit.edu" class="">mailto:labnetwork-bounces@mtl.mit.edu</a>] On Behalf Of Marc Zuiddam - TNW<br class="">Sent: Wednesday, 23 August 2017 10:29 PM<br class="">To: '<a href="mailto:labnetwork@mtl.mit.edu" class="">labnetwork@mtl.mit.edu</a>' <<a href="mailto:labnetwork@mtl.mit.edu" class="">labnetwork@mtl.mit.edu</a>><br class="">Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class=""><br class="">Dear people,<br class=""><br class="">I always have the idea that sputting/evaporating a thin Au layer on my<br class="">sample is exposing the e-beam resist on my sample.. Do you also experience<br class="">that?<br class=""><br class=""> Regards, Marc Zuiddam<br class=""><br class="">-----Original Message-----<br class="">From: <a href="mailto:labnetwork-bounces@mtl.mit.edu" class="">labnetwork-bounces@mtl.mit.edu</a><br class="">[<a href="mailto:labnetwork-bounces@mtl.mit.edu" class="">mailto:labnetwork-bounces@mtl.mit.edu</a>] On Behalf Of Fouad Karouta<br class="">Sent: woensdag 23 augustus 2017 1:42<br class="">To: Jugessur, Aju S; <a href="mailto:labnetwork@mtl.mit.edu" class="">labnetwork@mtl.mit.edu</a><br class="">Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class=""><br class="">Hi Aju,<br class=""><br class="">Am echoing other voices:<br class="">- We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we<br class="">remove in a Ki/I2 solution.<br class="">- Sometime we use Cr under resist layer as well when we need Cr for<br class="">further processing.<br class=""><br class="">Regards, Fouad Karouta<br class=""><br class="">*************************************<br class="">Manager ANFF ACT Node<br class="">Australian National Fabrication Facility Research School of Physics and<br class="">Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian<br class="">National University ACT 0200, Canberra, Australia<br class="">Tel: + 61 2 6125 7174<br class="">Mob: + 61 451 046 412<br class="">Email: <a href="mailto:fouad.karouta@anu.edu.au" class="">fouad.karouta@anu.edu.au</a><br class=""><a href="http://anff-act.anu.edu.au/" class="">http://anff-act.anu.edu.au/</a><br class=""><br class="">-----Original Message-----<br class="">From: labnetwork-bounces@mtl.mit.edu<br class="">[mailto:labnetwork-bounces@mtl.mit.edu] On Behalf Of Lino Eugene<br class="">Sent: Tuesday, 22 August 2017 11:49 PM<br class="">To: labnetwork@mtl.mit.edu<br class="">Cc: Steven Wei <c27wei@edu.uwaterloo.ca><br class="">Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class=""><br class="">Hi Aju,<br class=""><br class="">We have a coop student who has worked on different anti-charging<br class="">materials: PEDOT:PSS, Electra 92 and sputtered Al.<br class=""><br class="">We had also adhesion and uniformity issues with PEDOT:PSS from<br class="">Sigma-Aldrich. The solution was filtered and Triton X-100 was added and<br class="">but no noticeable improvement. I was told that surface treatment with<br class="">SurPass 3000 improves adhesion but we haven't tried this yet. Moreover,<br class="">PEDOT:PSS cross-links under certain conditions and then the layer cannot<br class="">be removed with water.<br class=""><br class="">10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is<br class="">expected to be high because of surface electron scattering (electron mean<br class="">free path in Al at room temperature is ~19nm) and oxidation. We use MF-319<br class="">at room temperature or 40 degC to remove the layer.<br class=""><br class="">Electra 92 from AllResist is easy to work with as it can be removed with<br class="">DI water after EBL and gives pretty good results on PMMA and on ZEP520A.<br class="">Surface treatment on HSQ is needed, so far treatment with IPA gives good<br class="">results. Also, the price is reasonable compared to ESpacer and AquaSave.<br class=""><br class="">Best,<br class=""><br class="">Lino Eugene, Ph.D., Jr. Eng.<br class="">Micro/nanofabrication process engineer<br class="">Quantum NanoFab<br class="">University of Waterloo<br class="">200 University Avenue West<br class="">Waterloo, ON, Canada<br class="">N2L 3G1<br class=""><br class="">Ph: +1 519-888-4567 #37788<br class="">Cell: +1 226-929-1685<br class="">Website: https://fab.qnc.uwaterloo.ca/<br class=""><br class="">-----Original Message-----<br class="">From: labnetwork-bounces@mtl.mit.edu<br class="">[mailto:labnetwork-bounces@mtl.mit.edu] On Behalf Of Matthew Moneck<br class="">Sent: August 21, 2017 21:09<br class="">To: Mark K Mondol <mondol@mit.edu>; labnetwork@mtl.mit.edu<br class="">Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class=""><br class="">Hi Aju,<br class=""><br class="">We have commonly used Al as a conductive layer on top of PMMA on glass<br class="">(removal is typically done with minimal damage by using dilute AZ400K<br class="">photoresist developer). However, 5nm seems to be on the thin side. Al<br class="">can form native oxide that is up to 3-4nm thick. Therefore, I would<br class="">confirm the answer to Mark's question of whether or not the 5nm Al layer<br class="">is conductive. We typically sputter deposit films that are 10-20nm thick<br class="">for our applications.<br class=""><br class="">Best Regards,<br class=""><br class="">Matt<br class=""><br class="">--<br class="">Matthew T. Moneck, Ph.D.<br class="">Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and<br class="">Computer Engineering | Carnegie Mellon University<br class="">5000 Forbes Ave., Pittsburgh, PA 15213-3890<br class="">T: 412.268.5430<br class="">F: 412.268.3497<br class="">www.ece.cmu.edu<br class="">nanofab.ece.cmu.edu<br class=""><br class=""><br class="">-----Original Message-----<br class="">From: labnetwork-bounces@mtl.mit.edu<br class="">[mailto:labnetwork-bounces@mtl.mit.edu] On Behalf Of Mark K Mondol<br class="">Sent: Monday, August 21, 2017 5:04 PM<br class="">To: labnetwork@mtl.mit.edu<br class="">Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class=""><br class="">Aju:<br class=""><br class="">1. Be 100% certain the layer is conductive and connected to ground in the<br class="">tool.<br class=""><br class="">2. Every time they write on glass, do the same exposure on Si, if the<br class="">problem shows up on both Si and glass the issue is not the insulating<br class="">substrate.<br class=""><br class="">3. Al etch can damage PMMA; not always in a repeatable way. Does your<br class="">process include etching the Al (I have found Transene CR-7 chrome etch to<br class="">be compatible with PMMA and ZEP, so usually use Cr not Al as the<br class="">conductive layer).<br class=""><br class="">Regards,<br class=""><br class="">Mark K MOndol<br class=""><br class="">--<br class="">Mark K Mondol<br class="">Assistant Director NanoStructures Laboratory And Facility Manager Scanning<br class="">Electron Beam Lithography Facility Bldg 36 Room 229 www.rle.mit.edu/sebl<br class="">mondol@mit.edu office - 617-253-9617 cell - 617-224-8756<br class=""><br class=""><br class="">_______________________________________________<br class="">labnetwork mailing list<br class="">labnetwork@mtl.mit.edu<br class="">https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork<br class=""><br class="">_______________________________________________<br class="">labnetwork mailing list<br class="">labnetwork@mtl.mit.edu<br class="">https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork<br class=""><br class="">_______________________________________________<br class="">labnetwork mailing list<br class="">labnetwork@mtl.mit.edu<br class="">https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork<br class=""><br class="">_______________________________________________<br class="">labnetwork mailing list<br class="">labnetwork@mtl.mit.edu<br class="">https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork<br class=""><br class="">_______________________________________________<br class="">labnetwork mailing list<br class="">labnetwork@mtl.mit.edu<br class="">https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork<br class=""><br class="">_______________________________________________<br class="">labnetwork mailing list<br class="">labnetwork@mtl.mit.edu<br class="">https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork<br class=""><br class="">_______________________________________________<br class="">labnetwork mailing list<br class="">labnetwork@mtl.mit.edu<br class="">https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork<br class=""></div></div></blockquote></div><br class=""></div></body></html>