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<p class="MsoNormal"><span style="color:#1F497D">Hi Jim,<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D">I used to sputter Palladium often. Steer clear of Indium, it’s along the lines of sputtering lead without the health concerns. It will make a nasty mess of the chamber. Indium is has a low vapor pressure and
will destroy the vacuum. It is also a “soft metal” at room temperature. It will implant all over the chamber and subsequent runs will dislodge the implanted indium. This will cause re-deposit. Bad idea.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D">People often add palladium to gold to decrease grain size of the gold. It works great. No vapor pressure issues, no cross contamination problems.
<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D">Hope it helps.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><br>
Dave<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.0pt;color:#1F497D">David Zapotok<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:10.0pt;color:#1F497D">Regional Sales Manager, Northeast<br>
<img width="147" height="44" id="Picture_x0020_1" src="cid:image001.jpg@01D34336.1CC90F30" alt="Logo_New2016"><br>
Phone: 617-794-7994<br>
<a href="mailto:dzapotok@tescan-usa.com"><span style="color:blue">dzapotok@tescan-usa.com</span></a><br>
<a href="http://www.tescan-usa.com/"><span style="color:blue">www.tescan-usa.com</span></a><br>
</span><span style="color:#1F497D"><img border="0" width="500" height="100" id="Picture_x0020_2" src="cid:image002.jpg@01D34336.1CC90F30" alt="s8000-02"></span><span style="font-size:10.0pt;color:#1F497D"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
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<p class="MsoNormal"><b>From:</b> labnetwork-bounces@mtl.mit.edu [mailto:labnetwork-bounces@mtl.mit.edu]
<b>On Behalf Of </b>Vlahakis, James<br>
<b>Sent:</b> Wednesday, October 11, 2017 5:39 PM<br>
<b>To:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> [labnetwork] sputtering In and Pa<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Hi everyone, one of our users would like to sputter materials that we are unfamiliar with, indium and palladium.
<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">We are considering allowing these materials in our “dirty” sputter tool which has few material restrictions – Au, Ag, Al, Cu, Ge, ITO, Mg, Ni, Ti, Zn and fully cured polymers are allowed. For ITO and Mg we require the users to follow up
with an Al sputter for encapsulation. <o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Your advice or comments would be much appreciated<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Thanks<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">jim<o:p></o:p></p>
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