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Hello Mark,<br>
<br>
Here is the link to the CDC website with Cd exposure limits.<br>
<a class="moz-txt-link-freetext" href="https://urldefense.proofpoint.com/v2/url?u=https-3A__www.atsdr.cdc.gov_csem_csem.asp-3Fcsem-3D6-26po-3D7&d=DwMDaQ&c=pZJPUDQ3SB9JplYbifm4nt2lEVG5pWx2KikqINpWlZM&r=EhqHy4a2rnA5a4ehzWAAfKveFS3lPv3RmQTaTocONM4&m=paqIUb_Y4G_a57SmOlow7d6JiqnQeZVGGx4IN4jjaUU&s=mh1sb9grYAXTukWGeEaK6dkF-3wXmmXVgVFYweJO2mE&e=">https://www.atsdr.cdc.gov/csem/csem.asp?csem=6&po=7</a><br>
<br>
Since you mentioned toxicity, I assume you are not worried about
process cross contamination and more concerned with the tool
operator/service engineer. This is less of a concern if the tool is
loadlocked compared to a non loadlocked etch system. I would
estimate the amount of material etched during the process would
leave a very small amount of Cd solids in the etch tool so the
exposure level would be minimum. I spent many years doing ZnCdSe
epi growth and we wore respirators during chamber cleans/maintenance
and kept the area around the tool very clean. After a service and
cleanup, we never had elevated Cd levels in the swipes that were
tested.<br>
<br>
Your waste from the tool (gloves, wipes, chamber cleaning debris,
sleeve guards) will all now have trace Cd and the EPA allows up to
1.0ppm of Cd in the waste stream. So to be safe, all the waste
should be bagged up and labeled accordingly, Cd is a RCRA metal.
Only Hg has a lower allowable limit of 0.2ppm, so Cd is one of the
more restricted RCRA metals to have to deal with.<br>
<br>
Unfortunately I have no CdS etch experience to further comment.<br>
<br>
Best Regards,<br>
Brent<br>
<div class="moz-signature"><br>
-- <br>
Brent P. Gila, PhD.<br>
Director, Nanoscale Research Facility<br>
1041 Center Drive<br>
University of Florida<br>
Gainesville, Florida 32611<br>
<a class="moz-txt-link-freetext" href="Tel:352-273-2245">Tel:352-273-2245</a><br>
Fax:352-846-2877<br>
<a class="moz-txt-link-abbreviated" href="mailto:email:bgila@ufl.edu">email:bgila@ufl.edu</a><br>
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<br>
<br>
<br>
<div class="moz-cite-prefix">On 10/24/2017 9:54 AM, Mark Morgan
wrote:<br>
</div>
<blockquote type="cite"
cite="mid:D11F874D-F59B-4660-A315-01FB79375343@uw.edu">
Greetings all,
<div class=""><br class="">
</div>
<div class="">we have a user that’s interested in putting CdS in
our etchers and i am loath to allow it due to its toxicity but i
thought i’d poll the group and hear what others have done. </div>
<div class=""><br class="">
</div>
<div class="">Any have experience with dry etching of this
material? or experience with this material as part of a process
within your etchers but not the primary etch target?</div>
<div class=""><br class="">
</div>
<div class="">Thank you so much for your comments and input.</div>
<div class=""><br class="">
</div>
<div class="">best regards</div>
<div class=""><br class="">
</div>
<div class=""><br class="">
<div class="">
<div style="color: rgb(0, 0, 0); letter-spacing: normal;
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<div style="color: rgb(0, 0, 0); letter-spacing: normal;
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<div class="">Mark D. Morgan<br class="">
Research Engineer, Washington Nanofabrication Facility
(WNF)<br class="">
National Nanotechnology Coordinated Infrastructure
(NNCI)<br class="">
University of Washington<br class="">
Fluke Hall 132, Box 352143<br class="">
(206) 221-6349<br class="">
<a href="mailto:mmorgan3@uw.edu" class="" moz-do-not-send="true">mmorgan3@uw.edu</a><br class="">
<a href="https://urldefense.proofpoint.com/v2/url?u=http-3A__www.wnf.washington.edu_&d=DwMFaQ&c=pZJPUDQ3SB9JplYbifm4nt2lEVG5pWx2KikqINpWlZM&r=_VzhfR25g4PxV91wRmPaWA&m=5KQHNOe2xyFXbvUWTq1FK8YaMaBhXoabmTe0O6oTgvA&s=j3WKRFookNl7AaFNiv4IBFfegj9tAQVTWno6ZKgZc4E&e=" class="" moz-do-not-send="true">http://www.wnf.washington.edu/</a></div>
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<br class="">
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