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<p class="MsoNormal">Hi,<o:p></o:p></p>
<p class="MsoNormal">Has anyone had experience with plasma etching of LiNbO3 films ? It is hard to etch so higher platen power is needed to enhance physical sputtering. What is the impact on etch rate of other processes like etching of Si, SiO2, SiN, etc. in
the same chamber ? How often is chamber liner needed to be scrubbed clean ? Will it shorten the life of turbo pump ? <o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Thank You,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Paul S. Horng, Ph.D<o:p></o:p></p>
<p class="MsoNormal">Process Engineer, UD NanoFab<o:p></o:p></p>
<p class="MsoNormal">457 ISE Lab<o:p></o:p></p>
<p class="MsoNormal">221 Academy Street, Newark, DE 19716<o:p></o:p></p>
<p class="MsoNormal">(302)831-4827<o:p></o:p></p>
<p class="MsoNormal">http://udnf.udel.edu<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
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