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<p class="MsoNormal">Hello All,<o:p></o:p></p>
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<p class="MsoNormal">Thanks for all the great feedback about the backside helium leak rate on the Oxford tools. To sum up it sounds like most labs strive to keep it less than 10 sccm and 6 -12 sccm is a typical range. It is very helpful to see that what
we observe is fairly typical. We have one process that etches at -100 C with very high RF and ICP power that requires < 5 sccm. We can get it there for this user but keeping it there is difficult. For those who asked for the drawings of our modified quartz
plate, I will send that to you individually. I plan to invest in some mechanical design engineering effort to make these cooled chucks perform better. I’ll share anything we come up with.<o:p></o:p></p>
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<p class="MsoNormal">Thanks again,<o:p></o:p></p>
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<p class="MsoNormal">Vince<o:p></o:p></p>
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<p class="MsoNormal"><span style="font-family:"Microsoft Sans Serif",sans-serif">Vincent K. Luciani<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-family:"Microsoft Sans Serif",sans-serif">NanoFab Manager<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-family:"Microsoft Sans Serif",sans-serif"><a href="http://www.cnst.nist.gov/"><span style="color:blue">Center for Nanoscale Science and Technology</span></a><o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-family:"Microsoft Sans Serif",sans-serif">National Institute of Standards and Technology<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-family:"Microsoft Sans Serif",sans-serif">100 Bureau Drive, MS 6201<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-family:"Microsoft Sans Serif",sans-serif">Gaithersburg, MD 20899-6200 USA<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-family:"Microsoft Sans Serif",sans-serif">+1-301-975-2886<o:p></o:p></span></p>
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