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<p style="margin-top:0;margin-bottom:0">The violet light you see in a plasma is going to be in the range of 380-450nm. As the reference below shows, PMMA absorption starts at 280nm and doesn't get really get going until 225nm. </p>
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</p>
<p style="margin-top:0;margin-bottom:0">That's a pronounced energy difference. If you really want to get emission below 350nm you need a mercury bulb or an excimer laser.</p>
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<p style="margin-top:0;margin-bottom:0">-Cliff</p>
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<p>Clifford Knollenberg</p>
<p>Science & Engineering Associate</p>
<p>Stanford Nano Shared Facilities (SNSF)</p>
<p>Email: cknollen@stanford.edu </p>
<p>Tel: 650-723-1675<br>
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<div id="divRplyFwdMsg" dir="ltr"><font face="Calibri, sans-serif" style="font-size:11pt" color="#000000"><b>From:</b> labnetwork-bounces@mtl.mit.edu <labnetwork-bounces@mtl.mit.edu> on behalf of Noah Clay <nclay@upenn.edu><br>
<b>Sent:</b> Thursday, August 24, 2017 6:29 PM<br>
<b>To:</b> N . Shane Patrick<br>
<b>Cc:</b> labnetwork@mtl.mit.edu; Ryan Anderson<br>
<b>Subject:</b> Re: [labnetwork] EBeam Lithography on Glass substrates</font>
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<div>Maybe this was mentioned earlier, but PMMA is strongly absorbing below 220 - 225 nm.</div>
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PMMA resists can also be patterned using UV-lithography, but only at exposure wavelengths of 200 – 270 nm (deep UV light).</div>
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On Aug 24, 2017, at 15:41, N . Shane Patrick <<a href="mailto:patricns@uw.edu" id="LPlnk447324" previewremoved="true">patricns@uw.edu</a>> wrote:<br>
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<blockquote type="cite">
<div>We use sputtered Au/Pd exclusively here as a charge dissipation layer and have not seen any adverse effects. Our system for this is a very basic tabletop coater system that runs on 120V and takes maybe 2 minutes of sputtering to get a sufficient coating
for our cases. Perhaps power/duration are important to consider.
<div class=""><br class="">
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<div class="">
<div class="">N. Shane Patrick<br class="">
Research Engineer, Washington Nanofabrication Facility (WNF) <br class="">
National Nanotechnology Coordinated Infrastructure (NNCI)<br class="">
University of Washington<br class="">
Fluke Hall 132, Box 352143</div>
<div class="">(206) 221-1045</div>
<div class=""><a href="mailto:patricns@uw.edu" class="" id="LPlnk928474" previewremoved="true">patricns@uw.edu</a></div>
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<blockquote type="cite" class="">
<div class="">On Aug 24, 2017, at 10:50 AM, Ryan Anderson <<a href="mailto:ryan@eng.ucsd.edu" class="" id="LPlnk812643" previewremoved="true">ryan@eng.ucsd.edu</a>> wrote:</div>
<br class="x_Apple-interchange-newline">
<div class="">
<div class="">Hi all,<br class="">
<br class="">
We have also observed adverse effects on PMMA exposure (100kV) after<br class="">
sputter coating gold. Since then we have used thermal evaporation.<br class="">
<br class="">
Ryan Anderson<br class="">
UC San Diego, Nano3<br class="">
<br class="">
<br class="">
-----Original Message-----<br class="">
From: <a href="mailto:labnetwork-bounces@mtl.mit.edu" class="" id="LPlnk540152" previewremoved="true">
labnetwork-bounces@mtl.mit.edu</a><br class="">
[<a href="mailto:labnetwork-bounces@mtl.mit.edu" class="" id="LPlnk153998" previewremoved="true">mailto:labnetwork-bounces@mtl.mit.edu</a>] On Behalf Of Fouad Karouta<br class="">
Sent: Wednesday, August 23, 2017 4:15 PM<br class="">
To: Marc Zuiddam - TNW <<a href="mailto:M.R.Zuiddam@tudelft.nl" class="" id="LPlnk974824" previewremoved="true">M.R.Zuiddam@tudelft.nl</a>>; '<a href="mailto:labnetwork@mtl.mit.edu" class="" id="LPlnk407710" previewremoved="true">labnetwork@mtl.mit.edu</a>'<br class="">
<<a href="mailto:labnetwork@mtl.mit.edu" class="" id="LPlnk671840" previewremoved="true">labnetwork@mtl.mit.edu</a>><br class="">
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class="">
<br class="">
Dear Marc,<br class="">
<br class="">
Evaporating Au on PMMA or ZEP should be done in a thermal evaporator, an<br class="">
e-beam evaporator due to the electron beam would affect the resist. We<br class="">
also avoid sputtering for this application as the effect of Ar plasma<br class="">
(violet colour) can be unpredictable.<br class="">
<br class="">
Regards, Fouad<br class="">
<br class="">
-----Original Message-----<br class="">
From: <a href="mailto:labnetwork-bounces@mtl.mit.edu" class="" id="LPlnk359392" previewremoved="true">
labnetwork-bounces@mtl.mit.edu</a><br class="">
[<a href="mailto:labnetwork-bounces@mtl.mit.edu" class="" id="LPlnk883429" previewremoved="true">mailto:labnetwork-bounces@mtl.mit.edu</a>] On Behalf Of Marc Zuiddam - TNW<br class="">
Sent: Wednesday, 23 August 2017 10:29 PM<br class="">
To: '<a href="mailto:labnetwork@mtl.mit.edu" class="" id="LPlnk538586" previewremoved="true">labnetwork@mtl.mit.edu</a>' <<a href="mailto:labnetwork@mtl.mit.edu" class="" id="LPlnk411503" previewremoved="true">labnetwork@mtl.mit.edu</a>><br class="">
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class="">
<br class="">
Dear people,<br class="">
<br class="">
I always have the idea that sputting/evaporating a thin Au layer on my<br class="">
sample is exposing the e-beam resist on my sample.. Do you also experience<br class="">
that?<br class="">
<br class="">
Regards, Marc Zuiddam<br class="">
<br class="">
-----Original Message-----<br class="">
From: <a href="mailto:labnetwork-bounces@mtl.mit.edu" class="" id="LPlnk497308" previewremoved="true">
labnetwork-bounces@mtl.mit.edu</a><br class="">
[<a href="mailto:labnetwork-bounces@mtl.mit.edu" class="" id="LPlnk477722" previewremoved="true">mailto:labnetwork-bounces@mtl.mit.edu</a>] On Behalf Of Fouad Karouta<br class="">
Sent: woensdag 23 augustus 2017 1:42<br class="">
To: Jugessur, Aju S; <a href="mailto:labnetwork@mtl.mit.edu" class="" id="LPlnk214535" previewremoved="true">
labnetwork@mtl.mit.edu</a><br class="">
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class="">
<br class="">
Hi Aju,<br class="">
<br class="">
Am echoing other voices:<br class="">
- We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we<br class="">
remove in a Ki/I2 solution.<br class="">
- Sometime we use Cr under resist layer as well when we need Cr for<br class="">
further processing.<br class="">
<br class="">
Regards, Fouad Karouta<br class="">
<br class="">
*************************************<br class="">
Manager ANFF ACT Node<br class="">
Australian National Fabrication Facility Research School of Physics and<br class="">
Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian<br class="">
National University ACT 0200, Canberra, Australia<br class="">
Tel: + 61 2 6125 7174<br class="">
Mob: + 61 451 046 412<br class="">
Email: <a href="mailto:fouad.karouta@anu.edu.au" class="" id="LPlnk116878" previewremoved="true">
fouad.karouta@anu.edu.au</a><br class="">
<a href="http://anff-act.anu.edu.au/" class="" id="LPlnk726803" previewremoved="true">http://anff-act.anu.edu.au/</a>
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-----Original Message-----<br class="">
From: <a href="mailto:labnetwork-bounces@mtl.mit.edu" id="LPlnk192487" previewremoved="true">
labnetwork-bounces@mtl.mit.edu</a><br class="">
[<a href="mailto:labnetwork-bounces@mtl.mit.edu" id="LPlnk201437" previewremoved="true">mailto:labnetwork-bounces@mtl.mit.edu</a>] On Behalf Of Lino Eugene<br class="">
Sent: Tuesday, 22 August 2017 11:49 PM<br class="">
To: <a href="mailto:labnetwork@mtl.mit.edu" id="LPlnk687015" previewremoved="true">
labnetwork@mtl.mit.edu</a><br class="">
Cc: Steven Wei <<a href="mailto:c27wei@edu.uwaterloo.ca" id="LPlnk410664" previewremoved="true">c27wei@edu.uwaterloo.ca</a>><br class="">
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class="">
<br class="">
Hi Aju,<br class="">
<br class="">
We have a coop student who has worked on different anti-charging<br class="">
materials: PEDOT:PSS, Electra 92 and sputtered Al.<br class="">
<br class="">
We had also adhesion and uniformity issues with PEDOT:PSS from<br class="">
Sigma-Aldrich. The solution was filtered and Triton X-100 was added and<br class="">
but no noticeable improvement. I was told that surface treatment with<br class="">
SurPass 3000 improves adhesion but we haven't tried this yet. Moreover,<br class="">
PEDOT:PSS cross-links under certain conditions and then the layer cannot<br class="">
be removed with water.<br class="">
<br class="">
10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is<br class="">
expected to be high because of surface electron scattering (electron mean<br class="">
free path in Al at room temperature is ~19nm) and oxidation. We use MF-319<br class="">
at room temperature or 40 degC to remove the layer.<br class="">
<br class="">
Electra 92 from AllResist is easy to work with as it can be removed with<br class="">
DI water after EBL and gives pretty good results on PMMA and on ZEP520A.<br class="">
Surface treatment on HSQ is needed, so far treatment with IPA gives good<br class="">
results. Also, the price is reasonable compared to ESpacer and AquaSave.<br class="">
<br class="">
Best,<br class="">
<br class="">
Lino Eugene, Ph.D., Jr. Eng.<br class="">
Micro/nanofabrication process engineer<br class="">
Quantum NanoFab<br class="">
University of Waterloo<br class="">
200 University Avenue West<br class="">
Waterloo, ON, Canada<br class="">
N2L 3G1<br class="">
<br class="">
Ph: +1 519-888-4567 #37788<br class="">
Cell: +1 226-929-1685<br class="">
Website: <a href="https://fab.qnc.uwaterloo.ca/" id="LPlnk507448" previewremoved="true">
https://fab.qnc.uwaterloo.ca/</a><br class="">
<br class="">
-----Original Message-----<br class="">
From: <a href="mailto:labnetwork-bounces@mtl.mit.edu" id="LPlnk660154" previewremoved="true">
labnetwork-bounces@mtl.mit.edu</a><br class="">
[<a href="mailto:labnetwork-bounces@mtl.mit.edu" id="LPlnk813609" previewremoved="true">mailto:labnetwork-bounces@mtl.mit.edu</a>] On Behalf Of Matthew Moneck<br class="">
Sent: August 21, 2017 21:09<br class="">
To: Mark K Mondol <<a href="mailto:mondol@mit.edu" id="LPlnk422947" previewremoved="true">mondol@mit.edu</a>>;
<a href="mailto:labnetwork@mtl.mit.edu" id="LPlnk143019" previewremoved="true">labnetwork@mtl.mit.edu</a><br class="">
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class="">
<br class="">
Hi Aju,<br class="">
<br class="">
We have commonly used Al as a conductive layer on top of PMMA on glass<br class="">
(removal is typically done with minimal damage by using dilute AZ400K<br class="">
photoresist developer). However, 5nm seems to be on the thin side. Al<br class="">
can form native oxide that is up to 3-4nm thick. Therefore, I would<br class="">
confirm the answer to Mark's question of whether or not the 5nm Al layer<br class="">
is conductive. We typically sputter deposit films that are 10-20nm thick<br class="">
for our applications.<br class="">
<br class="">
Best Regards,<br class="">
<br class="">
Matt<br class="">
<br class="">
--<br class="">
Matthew T. Moneck, Ph.D.<br class="">
Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and<br class="">
Computer Engineering | Carnegie Mellon University<br class="">
5000 Forbes Ave., Pittsburgh, PA 15213-3890<br class="">
T: 412.268.5430<br class="">
F: 412.268.3497<br class="">
<a href="http://www.ece.cmu.edu" id="LPlnk800281" previewremoved="true">www.ece.cmu.edu</a>
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<a id="LPUrlAnchor_15197541463320.6620812299756313" href="http://www.ece.cmu.edu/" target="_blank" style="text-decoration: none;">Electrical and Computer Engineering at Carnegie Mellon ...</a></div>
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www.ece.cmu.edu</div>
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ECE is a department of the Carnegie Institute of Technology at Carnegie Mellon University.</div>
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<a href="http://nanofab.ece.cmu.edu" id="LPlnk494000" previewremoved="true">nanofab.ece.cmu.edu</a>
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<a id="LPUrlAnchor_15197541767680.731417254957156" href="http://nanofab.ece.cmu.edu/" target="_blank" style="text-decoration: none;">Nanofabrication Laboratory at Carnegie Mellon University</a></div>
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nanofab.ece.cmu.edu</div>
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Nanofabrication Laboratory at Carnegie Mellon University. A lab of the Electrical and Computer Engineering Department.</div>
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-----Original Message-----<br class="">
From: <a href="mailto:labnetwork-bounces@mtl.mit.edu" id="LPlnk72016" previewremoved="true">
labnetwork-bounces@mtl.mit.edu</a><br class="">
[<a href="mailto:labnetwork-bounces@mtl.mit.edu" id="LPlnk411048" previewremoved="true">mailto:labnetwork-bounces@mtl.mit.edu</a>] On Behalf Of Mark K Mondol<br class="">
Sent: Monday, August 21, 2017 5:04 PM<br class="">
To: <a href="mailto:labnetwork@mtl.mit.edu" id="LPlnk758339" previewremoved="true">
labnetwork@mtl.mit.edu</a><br class="">
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates<br class="">
<br class="">
Aju:<br class="">
<br class="">
1. Be 100% certain the layer is conductive and connected to ground in the<br class="">
tool.<br class="">
<br class="">
2. Every time they write on glass, do the same exposure on Si, if the<br class="">
problem shows up on both Si and glass the issue is not the insulating<br class="">
substrate.<br class="">
<br class="">
3. Al etch can damage PMMA; not always in a repeatable way. Does your<br class="">
process include etching the Al (I have found Transene CR-7 chrome etch to<br class="">
be compatible with PMMA and ZEP, so usually use Cr not Al as the<br class="">
conductive layer).<br class="">
<br class="">
Regards,<br class="">
<br class="">
Mark K MOndol<br class="">
<br class="">
--<br class="">
Mark K Mondol<br class="">
Assistant Director NanoStructures Laboratory And Facility Manager Scanning<br class="">
Electron Beam Lithography Facility Bldg 36 Room 229 <a href="http://www.rle.mit.edu/sebl" id="LPlnk464985" previewremoved="true">
www.rle.mit.edu/sebl</a>
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<a id="LPUrlAnchor_15197542070880.3808987654525695" href="http://www.rle.mit.edu/sebl" target="_blank" style="text-decoration: none;">RLE :: SEBL at RLE :: MIT's Scanning-Electron-Beam ...</a></div>
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www.rle.mit.edu</div>
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T he scanning-electron-beam lithography (SEBL) facility enables the writing of patterns of arbitrary geometries with minimum features as fine as 17 nm.</div>
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<br class="">
<a href="mailto:mondol@mit.edu" id="LPlnk318745" previewremoved="true">mondol@mit.edu</a> office - 617-253-9617 cell - 617-224-8756<br class="">
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