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<p style="margin-top:0; margin-bottom:0">Dear All,</p>
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<p style="margin-top:0; margin-bottom:0"> We are having difficulties in doing metal(Ti/Pt) lift off on ceramic substrates. Does any of you have experience on fabricating metal patterns on the rough Ceramic Substrates. Below are the details of the process
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<p style="margin-top:0; margin-bottom:0"> The roughness of the ceramic substrates were approximately 400nm. We had used HMDS as adhesion promoter for lithography, the thickness of the Photoresist was ~ 1.5um.The thickness of the Ti/Pt layer was ~ 250nm.
Immediately after lithography the deposition was done followed by 48 hours of lift off(Acetone) process. Ultrasonication(5-10mins) in Acetone was done after 48hours. </p>
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<pre style="white-space:pre-wrap; font-size:9pt"><span style="font-size:9pt; font-family:"Arial Black",Arial,sans-serif"><font color="#ff0000"><span style="color:rgb(0,0,0)"><b><span style="color:rgb(34,34,34); font-family:arial,sans-serif; font-size:small">Best Regards</span><span class="HOEnZb"><font color="#888888"><br style="color:rgb(34,34,34); font-family:arial,sans-serif; font-size:small"></font></span></b><span class="HOEnZb"><font color="#888888"><div style="color:rgb(34,34,34); font-family:arial,sans-serif; font-size:small"><b><br><br>Adithi.U<br>Senior Facility Technologist,<br>National Nano Fabrication Centre,<br>CeNSE, Indian Institute of Science<br>Bangalore</b></div></font></span></span></font></span></pre>
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