<div dir="ltr"><div dir="ltr"><div class="gmail_default" style="font-family:arial,helvetica,sans-serif;color:#000000">Hi ADITHI, </div><div class="gmail_default" style="font-family:arial,helvetica,sans-serif;color:#000000">Could you please describe a little what exactly the problem is?</div><div class="gmail_default" style="font-family:arial,helvetica,sans-serif;color:#000000">Do you face delamination of metal?</div><div class="gmail_default" style="font-family:arial,helvetica,sans-serif;color:#000000">What is the technique used for deposition?</div><div class="gmail_default" style="font-family:arial,helvetica,sans-serif;color:#000000"><br></div></div><br><div class="gmail_quote"><div dir="ltr">On Fri, Jan 4, 2019 at 10:12 PM Hitesh Kamble <<a href="mailto:hit.kamble@gmail.com">hit.kamble@gmail.com</a>> wrote:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex"><div dir="auto">Hello Adithi,<div dir="auto"> In case of HMDS ,it will improve adhesion but resists will not remove easily from surafce.HMDS is mostly use in etching. Since you're having rough surface, <span style="font-family:sans-serif">Instead of HMDS use LOR 3B or say liftOFF resists which helps to improve liftoff process.</span></div><div dir="auto"><span style="font-family:sans-serif">Also for 250nm metallization you need more than 2um thick resists.</span></div><div dir="auto"><span style="font-family:sans-serif"><br></span></div><div dir="auto"><span style="font-family:sans-serif">We did not do this on ceramic samples exactly but successfully did liftoff on etched/textured glass and etched samples(roughness more than~400nm).</span></div><div dir="auto"><span style="font-family:sans-serif">Following are my suggestions:</span></div><div dir="auto"><span style="font-family:sans-serif">-Time Interval between litho and deposition should be lowest as possible</span></div><div dir="auto"><span style="font-family:sans-serif">- Dehydration at higher temp and for longer time.</span></div><div dir="auto"><font face="sans-serif">-LOR 3B coating at lower rpm and gradually increase rpm.</font></div><div dir="auto"><font face="sans-serif">-Keep sample in Remover PG and heat at 80C for 5min or more if metal not lifted,(Sonication not recquired in most cases)</font></div><div dir="auto"><br></div><div dir="auto"><br></div><div dir="auto"><font face="sans-serif">Thanks,</font></div><div dir="auto"><font face="sans-serif">Hitesh Kamble</font></div><div dir="auto"><font face="sans-serif">IITBNF-IIT Bombay</font></div><div dir="auto"><span style="font-family:sans-serif"><br></span></div><br><br><div class="gmail_quote" dir="auto"><div dir="ltr">On Fri 4 Jan, 2019, 6:08 PM ADITHI U <<a href="mailto:uadithi@iisc.ac.in" target="_blank">uadithi@iisc.ac.in</a> wrote:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex">
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<p style="margin-top:0px;margin-bottom:0px">Dear All,</p>
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<p style="margin-top:0px;margin-bottom:0px"> We are having difficulties in doing metal(Ti/Pt) lift off on ceramic substrates. Does any of you have experience on fabricating metal patterns on the rough Ceramic Substrates. Below are the details of the process
done.</p>
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<p style="margin-top:0px;margin-bottom:0px"> The roughness of the ceramic substrates were approximately 400nm. We had used HMDS as adhesion promoter for lithography, the thickness of the Photoresist was ~ 1.5um.The thickness of the Ti/Pt layer was ~ 250nm.
Immediately after lithography the deposition was done followed by 48 hours of lift off(Acetone) process. Ultrasonication(5-10mins) in Acetone was done after 48hours. </p>
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<pre style="white-space:pre-wrap;font-size:9pt"><span style="font-size:9pt;font-family:"Arial Black",Arial,sans-serif"><font color="#ff0000"><span style="color:rgb(0,0,0)"><b><span style="color:rgb(34,34,34);font-family:arial,sans-serif;font-size:small">Best Regards</span><span class="gmail-m_6845385362871991589m_-8304701522397863792HOEnZb"><font color="#888888"><br style="color:rgb(34,34,34);font-family:arial,sans-serif;font-size:small"></font></span></b><span class="gmail-m_6845385362871991589m_-8304701522397863792HOEnZb"><font color="#888888"><div style="color:rgb(34,34,34);font-family:arial,sans-serif;font-size:small"><b><br><br>Adithi.U<br>Senior Facility Technologist,<br>National Nano Fabrication Centre,<br>CeNSE, Indian Institute of Science<br>Bangalore</b></div></font></span></span></font></span></pre>
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</blockquote></div><br clear="all"><div><br></div>-- <br><div dir="ltr" class="gmail_signature"><div dir="ltr"><span style="font-family:monospace,monospace"><span style="color:rgb(0,0,0)">Sangeeth Kallatt<br><br></span></span></div></div></div>