<div dir="auto">Hello Adithi,<div dir="auto"> In case of HMDS ,it will improve adhesion but resists will not remove easily from surafce.HMDS is mostly use in etching. Since you're having rough surface, <span style="font-family:sans-serif">Instead of HMDS use LOR 3B or say liftOFF resists which helps to improve liftoff process.</span></div><div dir="auto"><span style="font-family:sans-serif">Also for 250nm metallization you need more than 2um thick resists.</span></div><div dir="auto"><span style="font-family:sans-serif"><br></span></div><div dir="auto"><span style="font-family:sans-serif">We did not do this on ceramic samples exactly but successfully did liftoff on etched/textured glass and etched samples(roughness more than~400nm).</span></div><div dir="auto"><span style="font-family:sans-serif">Following are my suggestions:</span></div><div dir="auto"><span style="font-family:sans-serif">-Time Interval between litho and deposition should be lowest as possible</span></div><div dir="auto"><span style="font-family:sans-serif">- Dehydration at higher temp and for longer time.</span></div><div dir="auto"><font face="sans-serif">-LOR 3B coating at lower rpm and gradually increase rpm.</font></div><div dir="auto"><font face="sans-serif">-Keep sample in Remover PG and heat at 80C for 5min or more if metal not lifted,(Sonication not recquired in most cases)</font></div><div dir="auto"><br></div><div dir="auto"><br></div><div dir="auto"><font face="sans-serif">Thanks,</font></div><div dir="auto"><font face="sans-serif">Hitesh Kamble</font></div><div dir="auto"><font face="sans-serif">IITBNF-IIT Bombay</font></div><div dir="auto"><span style="font-family:sans-serif"><br></span></div><br><br><div class="gmail_quote" dir="auto"><div dir="ltr">On Fri 4 Jan, 2019, 6:08 PM ADITHI U <<a href="mailto:uadithi@iisc.ac.in">uadithi@iisc.ac.in</a> wrote:<br></div><blockquote class="gmail_quote" style="margin:0 0 0 .8ex;border-left:1px #ccc solid;padding-left:1ex">
<div dir="ltr">
<div id="m_-8304701522397863792divtagdefaultwrapper" dir="ltr" style="font-size:12pt;color:rgb(0,0,0);font-family:Calibri,Helvetica,sans-serif,EmojiFont,"Apple Color Emoji","Segoe UI Emoji",NotoColorEmoji,"Segoe UI Symbol","Android Emoji",EmojiSymbols">
<p style="margin-top:0;margin-bottom:0">Dear All,</p>
<p style="margin-top:0;margin-bottom:0"><br>
</p>
<p style="margin-top:0;margin-bottom:0"> We are having difficulties in doing metal(Ti/Pt) lift off on ceramic substrates. Does any of you have experience on fabricating metal patterns on the rough Ceramic Substrates. Below are the details of the process
done.</p>
<p style="margin-top:0;margin-bottom:0"><br>
</p>
<p style="margin-top:0;margin-bottom:0"> The roughness of the ceramic substrates were approximately 400nm. We had used HMDS as adhesion promoter for lithography, the thickness of the Photoresist was ~ 1.5um.The thickness of the Ti/Pt layer was ~ 250nm.
Immediately after lithography the deposition was done followed by 48 hours of lift off(Acetone) process. Ultrasonication(5-10mins) in Acetone was done after 48hours. </p>
<div id="m_-8304701522397863792Signature">
<div id="m_-8304701522397863792divtagdefaultwrapper" dir="ltr" style="font-size:12pt;color:rgb(0,0,0);font-family:Calibri,Helvetica,sans-serif,EmojiFont,"Apple Color Emoji","Segoe UI Emoji",NotoColorEmoji,"Segoe UI Symbol","Android Emoji",EmojiSymbols">
<p><span id="m_-8304701522397863792ms-rterangepaste-start"></span></p>
<pre style="white-space:pre-wrap;font-size:9pt"><span style="font-size:9pt;font-family:"Arial Black",Arial,sans-serif"><font color="#ff0000"><span style="color:rgb(0,0,0)"><b><span style="color:rgb(34,34,34);font-family:arial,sans-serif;font-size:small">Best Regards</span><span class="m_-8304701522397863792HOEnZb"><font color="#888888"><br style="color:rgb(34,34,34);font-family:arial,sans-serif;font-size:small"></font></span></b><span class="m_-8304701522397863792HOEnZb"><font color="#888888"><div style="color:rgb(34,34,34);font-family:arial,sans-serif;font-size:small"><b><br><br>Adithi.U<br>Senior Facility Technologist,<br>National Nano Fabrication Centre,<br>CeNSE, Indian Institute of Science<br>Bangalore</b></div></font></span></span></font></span></pre>
<span id="m_-8304701522397863792ms-rterangepaste-end"></span><br>
<p></p>
</div>
</div>
</div>
</div>
_______________________________________________<br>
labnetwork mailing list<br>
<a href="mailto:labnetwork@mtl.mit.edu" target="_blank" rel="noreferrer">labnetwork@mtl.mit.edu</a><br>
<a href="https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork" rel="noreferrer noreferrer" target="_blank">https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork</a><br>
</blockquote></div></div>