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</o:shapelayout></xml><![endif]--></head><body lang=EN-US link=blue vlink=purple><div class=WordSection1><p class=MsoNormal>Labnetwork,<o:p></o:p></p><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal>We have a <a href="https://careers.ll.mit.edu/job/Microfabrication-Process-Engineer-MA/543784900/">Microfabrication Process Engineer</a> opening to work in our Microelectronics Laboratory. Our lab is US Government’s most advanced captive silicon fab, based on 200mm wafers with a commercial class tool set serving development and prototyping needs utilizing technologies including 90nm FDSOI CMOS, superconducting digital and quantum computing, photonics, and 2.5 and 3D integration.<o:p></o:p></p><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal>Kindly forward to those who may be interested.<o:p></o:p></p><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal><span style='color:#000066'>Dan Pulver<o:p></o:p></span></p><p class=MsoNormal><span style='color:#000066'>Microelectronics Laboratory Manager<o:p></o:p></span></p><p class=MsoNormal><span style='color:#000066'>MIT Lincoln Laboratory<o:p></o:p></span></p><p class=MsoNormal><span style='color:#000066'>244 Wood Street<o:p></o:p></span></p><p class=MsoNormal><span style='color:#000066'>Lexington, MA 02421<o:p></o:p></span></p><p class=MsoNormal><span style='color:#000066'>781-540-3906 mobile<o:p></o:p></span></p><p class=MsoNormal><span style='color:#000066'>781-981-1716 office<o:p></o:p></span></p><p class=MsoNormal><u><span style='color:blue'><a href="mailto:michelle.simoes@ll.mit.edu"><span style='color:blue'>daniel.pulver@ll.mit.edu</span></a><o:p></o:p></span></u></p><p class=MsoNormal><o:p> </o:p></p></div></body></html>