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<p class="MsoNormal">Sa’ad,<o:p></o:p></p>
<p class="MsoNormal"> Are you applying your tape manually on the hotplate at temperature? If so, UV tape adhesive will cross link at higher temperatures than your UV source delivers. Another possibility is overexposure. Best way to handle it is with a D.O.E
using different exposure times. You will find that the window between underexposing and overexposing is fairly generous. I do suspect the elevated temperature on the hotplate being the root cause if that’s what you’re doing.<o:p></o:p></p>
<p class="MsoNormal"> I hope this helps,<o:p></o:p></p>
<p class="MsoNormal"> Steve (Equipment Dood)<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal"><span style="font-size:14.0pt">Steve Paolini<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:14.0pt">Principal Equipment Engineer<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:14.0pt">Harvard University Center for Nanoscale Systems<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:14.0pt">11 Oxford St.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:14.0pt">Cambridge, MA 02138<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:14.0pt">617- 496- 9816<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:14.0pt">spaolini@cns.fas.harvard.edu<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:14.0pt">www.cns.fas.harvard.edu</span><span style="font-size:14.0pt"><o:p></o:p></span></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal"><b>From:</b> labnetwork-bounces@mtl.mit.edu <labnetwork-bounces@mtl.mit.edu>
<b>On Behalf Of </b>Hassan, Sa'ad<br>
<b>Sent:</b> Thursday, May 16, 2019 1:40 PM<br>
<b>To:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> [labnetwork] Diced Samples Glued to UV Release Tape<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Hello All,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">As part of the last step of processing, I take wafers (Si and SiC), with photoresist on top, dice them, die expand them on a hotplate at 55 degrees Celsius. And finally UV release the tape. I’ve noticed that sporadically, rather than the
tape losing adhesion, the opposite happens: the die end up cemented to the tape. Has anyone experienced anything like this before?<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Cheers,<o:p></o:p></p>
<p class="MsoNormal">Sa’ad<o:p></o:p></p>
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