<div dir="ltr"><div dir="ltr">Dear
Sa’ad,<div><br></div><div>I have faced similar issue few years back,</div><div>have tried different approaches like using UV exposure with mask aligner(MJB3)<br></div><div>and with a direct UV bulb encased, varying exposure time and increasing the distance between the UV bulb and sample helped.</div><div><br></div><div>You need to fine tune with the UV exposure dose(varying time or intensity, high intensity UV bulb produces heat), </div><div>decreasing temperature of hotplate, and increasing sample distance from UV source.</div><div><br></div><div><div dir="ltr" class="gmail_signature"><div dir="ltr"><div><div dir="ltr"><div><div dir="ltr"><div><div><span style="font-size:12.8px">With Regards,</span><br></div><div>Siva Penmetsa,</div><div>Technology Manager,</div><div>Lithography and Dry Etch,</div><div>National Nano Fabrication Centre(NNfC),</div><div>Centre for Nano Science And Engineering(CeNSE),</div><div>Indian Institute of Science(IISc), Bangalore</div></div></div></div></div></div></div></div></div></div><br><div class="gmail_quote"><div dir="ltr" class="gmail_attr">On Fri, May 17, 2019 at 2:00 AM Hassan, Sa'ad <<a href="mailto:Sa%27ad.Hassan@nrc-cnrc.gc.ca">Sa'ad.Hassan@nrc-cnrc.gc.ca</a>> wrote:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex">
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<p class="MsoNormal">Hello All,<u></u><u></u></p>
<p class="MsoNormal"><u></u> <u></u></p>
<p class="MsoNormal">As part of the last step of processing, I take wafers (Si and SiC), with photoresist on top, dice them, die expand them on a hotplate at 55 degrees Celsius. And finally UV release the tape. I’ve noticed that sporadically, rather than the
tape losing adhesion, the opposite happens: the die end up cemented to the tape. Has anyone experienced anything like this before?<u></u><u></u></p>
<p class="MsoNormal"><u></u> <u></u></p>
<p class="MsoNormal">Cheers,<u></u><u></u></p>
<p class="MsoNormal">Sa’ad<u></u><u></u></p>
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