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<p class="MsoNormal">Hi All,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal"> The key to controlling the footing (also called notching, this is the sidewall attack seen on insulating stop layers) is using pulsed bias power. This can be done with either HF or LF bias power operation, as long as the
bias generator can apply it in a controllable and pulsed mode operation. On newer SPTS DRIE etch modules (Rapier or DSi-v) this is done with either HF (13.56 MHz) or LF (380 kHz) pulsing with recipe controlled setpoints for the pulsing ON time and pulsing
OFF time. In most applications the use of HF pulsed bias power is the default operation but in some unique applications the use of LF pulsed bias power yields better results. Our default offering on new DRIE etch modules uses HF bias power but LF bias power
is an optional upgrade should it be needed.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">If you let me know model or serial no. of the SPTS system in question I can advise further on what might be best for notch control.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">And as Greg mentioned, the use of endpoint control for monitoring the actual Si etch will enable the best path for minimal notch size. Our newer DRIE modules utilize our Claritas OES endpoint system which is class-leading in terms of operations
for all applications. This monitors the Si etch process and can be setup to change the DRIE recipe conditions based on Si etch feedback. This enable process time control as well as soft-landing conditions on etch stop layers.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Hope that helps.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<div>
<p class="MsoNormal">Regards,<o:p></o:p></p>
<p class="MsoNormal">Steve<o:p></o:p></p>
<p class="MsoNormal"><span style="color:#6689CD"><br>
</span><b><span style="color:#00386A">Stephen Vargo, Ph.D., Senior Global Applications Manager</span></b><b><span style="color:#1E1D78"><br>
</span></b><span style="color:#00386A">SPTS Technologies, Inc., A KLA Company<b><o:p></o:p></b></span></p>
<p class="MsoNormal"><span style="color:#00386A">T. | M. +1 (626) 233-0687 spts.com<o:p></o:p></span></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<div style="border:none;border-top:solid #E1E1E1 1.0pt;padding:3.0pt 0in 0in 0in">
<p class="MsoNormal"><b>From:</b> Greg Hollingshead <Greg.Hollingshead@spts.com> <br>
<b>Sent:</b> Friday, February 28, 2020 12:52 PM<br>
<b>To:</b> mtkhbeis@gmail.com; labnetwork@mtl.mit.edu; bob.henderson@etchedintimeinc.com<br>
<b>Cc:</b> Steve Vargo <Steve.Vargo@spts.com><br>
<b>Subject:</b> SPTS Technologies<o:p></o:p></p>
</div>
</div>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Hello Dr. Michael Khbeis and Bob Henderson;<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">We can usually control undercutting (footing) at a stop layer and/or provide endpoint on a stop layer. However, not knowing the stop layer material or the system you are using it is difficult to advise further. If you are using a legacy
system this may or may not be possible.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Can you give Steve and I more information on the etch process? Depths, feature sizes, stop layer material? Also what model of DRIE system from SPTS is it?<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Regards,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal"><b><o:p> </o:p></b></p>
<p class="MsoNormal"><b>From:</b> <a href="mailto:mtkhbeis@gmail.com"><span style="color:blue">mtkhbeis@gmail.com</span></a> <<a href="mailto:mtkhbeis@gmail.com"><span style="color:blue">mtkhbeis@gmail.com</span></a>>
<br>
<b>Sent:</b> Thursday, February 27, 2020 10:42 PM<br>
<b>To:</b> Mick Krieg <<a href="mailto:Mick.Krieg@spts.com"><span style="color:blue">Mick.Krieg@spts.com</span></a>><br>
<b>Subject:</b> Fwd: [labnetwork] SPTS DRIE Question<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal" style="margin-bottom:12.0pt">FYI <o:p></o:p></p>
<p class="MsoNormal">Dr. Michael Khbeis<o:p></o:p></p>
<p class="MsoNormal" style="margin-bottom:12.0pt">(C) <a href="tel:443.254.5192"><span style="color:blue">443.254.5192</span></a><o:p></o:p></p>
<p class="MsoNormal" style="margin-bottom:12.0pt"><br>
Begin forwarded message:<o:p></o:p></p>
<p class="MsoNormal" style="margin-bottom:12.0pt"><b><span style="background:yellow;mso-highlight:yellow">From:</span></b><span style="background:yellow;mso-highlight:yellow">
<a href="mailto:bob.henderson@etchedintimeinc.com"><span style="color:blue">bob.henderson@etchedintimeinc.com</span></a><br>
<b>Date:</b> February 27, 2020 at 1:05:26 PM PST<br>
<b>To:</b> <a href="mailto:labnetwork@mtl.mit.edu"><span style="color:blue">labnetwork@mtl.mit.edu</span></a><br>
<b>Subject:</b> <b>[labnetwork] SPTS DRIE Question</b><o:p></o:p></span></p>
<p class="MsoNormal"><span style="background:yellow;mso-highlight:yellow"><o:p></o:p></span></p>
<p class="MsoNormal"><span style="background:yellow;mso-highlight:yellow">I know a number of you have SPTS DRIE systems and I would like to ask what hardware configuration is necessary to prevent undercut (Footing) at the sacrificial stop layer at completion
of etch. I have been told that it requires a different frequency generator than 13.56 MHz used for the bulk etch. Do the newer tools also have some method of endpoint on the stop layer or is it just a timed etch? Your help is appreciated<o:p></o:p></span></p>
<p class="MsoNormal"><span style="background:yellow;mso-highlight:yellow"> <o:p></o:p></span></p>
<p class="MsoNormal"><span style="background:yellow;mso-highlight:yellow">Bob Henderson<o:p></o:p></span></p>
<p class="MsoNormal"><span style="background:yellow;mso-highlight:yellow">Etched In Time, Inc<o:p></o:p></span></p>
<p class="MsoNormal"><span style="background:yellow;mso-highlight:yellow">941 S. Park Lane<o:p></o:p></span></p>
<p class="MsoNormal"><span style="background:yellow;mso-highlight:yellow">Tempe, Arizona 85281<o:p></o:p></span></p>
<p class="MsoNormal"><span style="background:yellow;mso-highlight:yellow">Phone: 602-206-6154</span><o:p></o:p></p>
<p class="MsoNormal">_______________________________________________<br>
labnetwork mailing list<br>
<a href="mailto:labnetwork@mtl.mit.edu"><span style="color:blue">labnetwork@mtl.mit.edu</span></a><br>
<a href="https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork"><span style="color:blue">https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork</span></a><o:p></o:p></p>
<p class="MsoNormal"><span lang="EN-GB"><o:p> </o:p></span></p>
<p class="MsoNormal"><span lang="EN-GB"><o:p> </o:p></span></p>
<p class="MsoNormal" style="line-height:16.0pt;mso-line-height-rule:exactly"><b><span style="font-size:10.0pt;font-family:"Arial",sans-serif;color:#00386A">Greg Hollingshead, Southwestern Regional Sales Manager<o:p></o:p></span></b></p>
<p class="MsoNormal" style="line-height:16.0pt;mso-line-height-rule:exactly"><span style="font-size:10.0pt;font-family:"Arial",sans-serif;color:#00386A">SPTS Technologies Ltd, A KLA Company<o:p></o:p></span></p>
<p class="MsoNormal" style="line-height:16.0pt;mso-line-height-rule:exactly"><span style="font-size:10.0pt;font-family:"Arial",sans-serif;color:#00386A">M.</span><span lang="EN-GB" style="font-size:10.0pt;font-family:"Arial",sans-serif;color:#00386A"> +1 (</span><span style="font-size:10.0pt;font-family:"Arial",sans-serif;color:#00386A">972)
342 9722 (Austin TX) spts.com<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-GB"><o:p> </o:p></span></p>
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