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<p class="MsoNormal">Hi Natalia,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">I’ve tried dicing 600um sapphire with resin hubless blade at 3mm/sec, 15krmp, and the blades always chip. The manufacturer also recommended depth-step as Ahdam suggested but I haven’t got time to try it. (It would be quite slow though).<o:p></o:p></p>
<p class="MsoNormal">My colleague at UNSW uses a standard procedure (one-step) with VT07/12 blades that I am keen to try. I found the blade and dicing information here and the result looks pretty decent.<o:p></o:p></p>
<p class="MsoNormal"><a href="https://www.aurotech.com/index.php/en/products/dicing-blade/vt07-12-series-detail">https://www.aurotech.com/index.php/en/products/dicing-blade/vt07-12-series-detail</a><o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Hope this helps.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Best,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Gloria<o:p></o:p></p>
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<p class="MsoNormal"><b><span lang="EN-US">From:</span></b><span lang="EN-US"> labnetwork <labnetwork-bounces@mtl.mit.edu>
<b>On Behalf Of </b>Ahdam Ali<br>
<b>Sent:</b> Saturday, May 15, 2021 1:12 AM<br>
<b>To:</b> Natalia Pankratova <natalia.a.pankratova@gmail.com><br>
<b>Cc:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> Re: [labnetwork] Sapphire dicing<o:p></o:p></span></p>
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<p class="MsoNormal">Natalia,<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">At Nano3, we utilize a Disco DAD3220 Dicing Saw with Hubless blades in order to dice sapphire substrates. The process is relatively fool-proof, but one must be careful with dicing parameters. Cutting glass or sapphire typically require
depth steps (multiple passes along a single cut) as well as very low feed speeds in order to ensure the integrity of the sample. This results in a considerably lower throughput when compared to dicing of a material such as Si.<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Best,<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">On Fri, May 14, 2021 at 4:57 AM Natalia Pankratova <<a href="mailto:natalia.a.pankratova@gmail.com">natalia.a.pankratova@gmail.com</a>> wrote:<o:p></o:p></p>
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<p class="MsoNormal">Dear All,<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Can you please share your experience on dicing sapphire wafers? Blade dicing or laser? Do you have a favorite dicing brand/model?<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Thank you in advance!<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Best regards,<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Natalia Pankratova.<o:p></o:p></p>
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<p class="MsoNormal"><i><span style="font-size:7.5pt">Alice&Bob</span></i><o:p></o:p></p>
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<p class="MsoNormal"><i><span style="font-size:7.5pt">Nanofabrication engineer</span></i><o:p></o:p></p>
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<p class="MsoNormal">_______________________________________________<br>
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<p class="MsoNormal">-- <o:p></o:p></p>
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<p class="MsoNormal">Ahdam Ali<o:p></o:p></p>
<p class="MsoNormal"><span style="font-size:10.0pt;font-family:"Arial",sans-serif;color:#222222">R&D Engineer II<o:p></o:p></span></p>
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