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We are having issues with cutting glass/quartz or alumina wafers
with our Disco DAD3240 dicing saw<br>
<p><span
style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D;mso-fareast-language:EN-US"><font
color="#000000">We’re using composite Thermocarbon blades @
20K rpm and tried feed speeds ranging between 0.5-5 mm/sec.
Sample thickness varies but even for thinner ones (500-700 um)
we’re having a problem that the blade breaks. Looks like the
blade trajectory is bending during the cut and this causes
catastrophic damage to the blade. Why this bending occurs is
not clear. Maybe the problem is in the blue tape we use to
secure samples, but we don’t observe any apparent displacement
of the sample on the film. <br>
</font></span></p>
<p><span
style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D;mso-fareast-language:EN-US"><font
color="#000000">Anyone else having similar issues? Any
suggestions?</font></span></p>
<p><span
style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D;mso-fareast-language:EN-US"><font
color="#000000">Regards,</font></span></p>
<p><span
style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D;mso-fareast-language:EN-US"><font
color="#000000">Mario<br>
</font></span></p>
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<img src="cid:part1.7D57B750.7039D763@physics.ubc.ca" border="0"></div>
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