<div dir="ltr"><div class="gmail_default" style="font-family:verdana,sans-serif;color:#000000">Hello Mario,</div><div class="gmail_default" style="font-family:verdana,sans-serif;color:#000000"><br></div><div class="gmail_default" style="font-family:verdana,sans-serif;color:#000000">We also dice relatively thick glass and quartz substrates. As already mentioned, minimizing your blade exposure and a multipass cutting strategy are a must for these types of substrates. We may also have additional recommendations depending on the specific blades, flanges, and tape (sizes, part numbers) you are using.</div><div class="gmail_default" style="font-family:verdana,sans-serif;color:#000000"><br></div><div><div dir="ltr" class="gmail_signature" data-smartmail="gmail_signature"><div dir="ltr"><div><div dir="ltr"><div><div dir="ltr"><div><div dir="ltr"><div><div><font size="2" face="verdana, sans-serif"><font color="#000000">Thanks,</font></font></div><div><font size="2" face="verdana, sans-serif"><font color="#000000">Jim Carroll<br></font><b style="color:rgb(0,0,0)">PhotomaskPORTAL</b><font color="#000000"><br></font></font></div><div><font color="#000000"><font size="2" face="verdana, sans-serif"><i>We help you make masks</i><br><span title="Call with Google Voice"><span title="Call with Google Voice"><span title="Call with Google Voice"><span title="Call with Google Voice"><span title="Call with Google Voice"><span title="Call with Google Voice"><span title="Call with Google Voice"><span title="Call with Google Voice"><span title="Call with Google Voice"><span title="Call with Google Voice"><span title="Call with Google Voice"><span title="Call with Google Voice">(415) 448-6275</span></span></span></span></span></span></span></span></span></span></span></span></font></font></div><div></div></div><div><ul style="margin:0px;padding:0px 0px 8px;border:0px;outline:0px;font-size:11.818181991577148px;font-family:Helvetica,Arial,sans-serif;vertical-align:baseline;list-style:none;line-height:16.988636016845703px;display:table-cell;width:502.7272644042969px"><li style="margin:0px;padding:8px 12px 2px 0px;border:0px;outline:0px;font-style:inherit;font-size:11px;font-family:inherit;vertical-align:baseline;font-variant:inherit;line-height:1.2em"><dl style="margin:0px;padding:0px;border:0px;outline:0px;font-style:inherit;font-size:10.909090995788574px;font-family:inherit;vertical-align:baseline;font-variant:inherit;line-height:inherit;word-wrap:break-word"><a href="http://www.photomaskportal.com" target="_blank"><dl style="margin:0px;padding:0px;border:0px;outline:0px;font-style:inherit;font-size:10.909090995788574px;font-family:inherit;vertical-align:baseline;font-variant:inherit;line-height:inherit;word-wrap:break-word"><img src="http://www.photomaskportal.com/uploads/1/1/6/1/11617247/9425470.png" width="200" height="56"><br></dl></a></dl></li></ul></div></div></div></div></div></div></div></div></div></div><br></div><br><div class="gmail_quote"><div dir="ltr" class="gmail_attr">On Fri, Sep 10, 2021 at 6:47 AM N Shane Patrick <<a href="mailto:patricns@uw.edu">patricns@uw.edu</a>> wrote:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex"><div style="overflow-wrap: break-word;">Hello Mario,<div><br></div><div>Blade breakage with harder materials is always a challenge, but we’ve found Disco’s engineers to be quite responsive to dicing challenges and suggestions to solve them.</div><div><br></div><div>For our in-house cutting on our DAD321, we’ve found different blades are needed for glass vs. Quartz/sapphire.</div><div><br></div><div>We usually source our blades directly from Disco rather than thermocarbon (though we’ve used them in the past). Our current recommendations for the most common materials are the following:</div><div><br></div><div><div title="Page 10"><div><div><p><span style="font-size:11pt;font-family:Calibri">Silicon: ZH05 series</span></p><p><span style="font-size:11pt;font-family:Calibri">Glass/Quartz: R07 series</span></p><p><font face="Calibri"><span style="font-size:14.6667px">Sapphire:</span><span style="font-size:11pt"> VT07 series</span></font></p></div>
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</div></div><div><div><br></div><div>We’ve also found switching to a multipass cutting strategy can help with harder/thicker materials. We also dice on Blue Tape for the vast majority of this work.</div><div><br></div><div>My personal experience with bending/breaking has been that the blade is likely not rigorous enough to stand up to the hardness of the material being cut, so a slight deflection seems to become unrecoverable and eventually the blade deviates enough to break. I would, again however, strongly suggest getting in touch with Disco to discuss your particularly challenges and needs as, again, we’ve had very good response from them. I’m afraid I don’t have much in the way of direct recommendations, however, if you need to continue using thermocarbon blades.</div><div><br></div><div>Good Luck.</div><div><br></div><div>
<div dir="auto" style="color:rgb(0,0,0);letter-spacing:normal;text-align:start;text-indent:0px;text-transform:none;white-space:normal;word-spacing:0px;text-decoration:none"><div>N. Shane Patrick<br>Manager, Lab Operations and Safety<br>Electron Beam Lithography<br>Washington Nanofabrication Facility (WNF) <br>National Nanotechnology Coordinated Infrastructure (NNCI)<br>University of Washington - NanoES<br>Fluke Hall 129, Box 352143<br>(206) 221-1045<br><a href="mailto:patricns@uw.edu" target="_blank">patricns@uw.edu</a><br><a href="http://www.wnf.washington.edu/" target="_blank">http://www.wnf.washington.edu/</a></div></div>
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<div><br><blockquote type="cite"><div>On Sep 9, 2021, at 3:52 PM, Beaudoin, Mario <<a href="mailto:beaudoin@physics.ubc.ca" target="_blank">beaudoin@physics.ubc.ca</a>> wrote:</div><br><div>
<div>
We are having issues with cutting glass/quartz or alumina wafers
with our Disco DAD3240 dicing saw<br><p><span style="font-size:11pt;font-family:Calibri,sans-serif;color:rgb(31,73,125)"><font>We’re using composite Thermocarbon blades @
20K rpm and tried feed speeds ranging between 0.5-5 mm/sec.
Sample thickness varies but even for thinner ones (500-700 um)
we’re having a problem that the blade breaks. Looks like the
blade trajectory is bending during the cut and this causes
catastrophic damage to the blade. Why this bending occurs is
not clear. Maybe the problem is in the blue tape we use to
secure samples, but we don’t observe any apparent displacement
of the sample on the film. <br>
</font></span></p><p><span style="font-size:11pt;font-family:Calibri,sans-serif;color:rgb(31,73,125)"><font>Anyone else having similar issues? Any
suggestions?</font></span></p><p><span style="font-size:11pt;font-family:Calibri,sans-serif;color:rgb(31,73,125)"><font>Regards,</font></span></p><p><span style="font-size:11pt;font-family:Calibri,sans-serif;color:rgb(31,73,125)"><font>Mario<br>
</font></span></p>
<div>-- <br>
<span id="gmail-m_4995696059474652633cid:part1.7D57B750.7039D763@physics.ubc.ca"><Mario Beaudoin SBQMI sig 2.jpg></span></div>
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