<div dir="ltr">Hi Rob,<div><br></div><div>Is there any reason to hold the pair before the anneal, some other processing being done? I assume you are doing manual wafer bonding (not tool assisted)? During graduate work, we made a lot of manual hydrophilic SiO2-SiO2 bonds, and did not notice any degradation on holding off anneals in terms of bond strength/bond area for sample weeks+ old (samples kept in ~70 F environment, low humidity). </div><div><br></div><div>Kind Regards,</div><div>Jeff McKay</div></div><br><div class="gmail_quote"><div dir="ltr" class="gmail_attr">On Tue, Oct 12, 2021 at 5:06 PM Macdonald, Robert (GE Research, US) <<a href="mailto:robert.macdonald@ge.com">robert.macdonald@ge.com</a>> wrote:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex">I am looking for information on the limits of hold time after a fusion bond. <br>
<br>
Whether it be Si to Si or Si to SiO2 or SiO2 to SiO2; Whether hydrophobic or hydrophilic, for what amount of time can the bonded pair be held prior to anneal? <br>
<br>
I have not found a paper with this information. We have had success with times under sixteen hours. But we have not done a thorough study. <br>
<br>
Any input welcome. <br>
<br>
Thanks,<br>
Rob MacDonald<br>
GE Research<br>
<br>
<br>
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Sent from my iPhone<br>
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