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<p class="MsoNormal">HF vapor release may be an option. Various NNIN centers have these tools available for you.<o:p></o:p></p>
<p class="MsoNormal">Here is SPTS’s sales brochure:<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal"><a href="https://www.spts.com/assets/media/hf-intro-us-feb2021.pdf">https://www.spts.com/assets/media/hf-intro-us-feb2021.pdf</a><o:p></o:p></p>
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<p class="MsoNormal"><b>From:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> <b>
On Behalf Of </b>Felix Lu<br>
<b>Sent:</b> Tuesday, October 26, 2021 10:15 PM<br>
<b>To:</b> Maduzia, Joseph Walter <jmaduzi2@illinois.edu>; labnetwork@mtl.mit.edu<br>
<b>Subject:</b> EXT: Re: [labnetwork] Mask of Al in HF<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Hi Joe – <o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">An HF etch with Al is tough. We had a similar problem about 10 years ago. From what I can recall, we changed the order of operations, evaporating Al through a shadow mask after the HF etch. This of course required a special jig. I’m happy
to share more details if this approach is of interest to you.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Best,<o:p></o:p></p>
<p class="MsoNormal">Felix<o:p></o:p></p>
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<p class="MsoNormal"><span style="color:black">___________________________________________________<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:black">Felix P. Lu, Ph.D.</span><o:p></o:p></p>
<p class="MsoNormal"><span style="color:black">Director of Corporate Engagement<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:black"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="color:#C00000">Pritzker School of Molecular Engineering<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:black">The University of Chicago<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:black">Eckhardt Research Center<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:black">5640 S. Ellis Ave., Room ACC104<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:black">Chicago, IL 60637<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:black"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="color:black">773.834.5063 office<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:black"><o:p> </o:p></span></p>
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<p class="MsoNormal"><span style="color:black"><a href="mailto:fplu@uchicago.edu">fplu@uchicago.edu</a> |
<a href="http://pme.uchicago.edu/">pme.uchicago.edu</a></span><o:p></o:p></p>
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<p class="MsoNormal" style="margin-bottom:12.0pt"><b><span style="font-size:12.0pt;color:black">From:
</span></b><span style="font-size:12.0pt;color:black">labnetwork <<a href="mailto:labnetwork-bounces@mtl.mit.edu">labnetwork-bounces@mtl.mit.edu</a>> on behalf of Maduzia, Joseph Walter <<a href="mailto:jmaduzi2@illinois.edu">jmaduzi2@illinois.edu</a>><br>
<b>Date: </b>Tuesday, October 26, 2021 at 8:07 PM<br>
<b>To: </b><a href="mailto:labnetwork@mtl.mit.edu">labnetwork@mtl.mit.edu</a> <<a href="mailto:labnetwork@mtl.mit.edu">labnetwork@mtl.mit.edu</a>><br>
<b>Subject: </b>[labnetwork] Mask of Al in HF<o:p></o:p></span></p>
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<p class="MsoNormal">Hello,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Does anyone have any suggestions for mask materials to protect Al in HF 49% for SiO2 removal in SOI wafer? The device is SOI, ICP DRIE etched to glass, HF etch to undercut and free devices, but have Al contact pads and AL is dep’d first.
Typically we use PR as pattern mask, but the Al is etching behind the PR. In this case the Al is deposited first, so although order of operations change might help, it’s not a good option atm.<o:p></o:p></p>
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Thank you for any suggestions you might have!<o:p></o:p></p>
<p class="MsoNormal"><b><span style="color:#13294B;text-transform:uppercase">JOE MADUZIA</span></b><span style="color:black"><br>
</span><i><span style="color:#13294B">MNMS Laboratory Specialist</span></i><span style="color:black"><br>
<br>
</span><span style="color:#13294B">The Grainger College of Engineering</span><span style="color:black"><br>
</span><span style="color:#13294B">Mechanical Science and Engineering</span><span style="color:black"><br>
<br>
</span><span style="color:#13294B">2239 Sidney Lu Mechanical Engineering Bldg</span><span style="color:black"><br>
</span><span style="color:#13294B">1206 W. Green</span><span style="color:black"><br>
</span><span style="color:#13294B">Urbana, IL 61801</span><span style="color:black"><br>
</span><span style="color:#13294B">217.244.6302 | </span><a href="mailto:jmaduzi2@illinois.edu">jmaduzi2@illinois.edu</a><o:p></o:p></p>
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</span><i><span style="color:#666666">Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure.</span></i><o:p></o:p></p>
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