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/*]]>*/</style></div><div>Hi Joe, <br></div><div>We switched to Au pads and also going to vapour HF to release SOI waveguides a while back (some 20yrs...). <br data-mce-bogus="1"></div><div>I am looking for a ´modern´ solution for this as well, so I hope someone points out that nowadays compound X by company Y does this very easily... <br data-mce-bogus="1"></div><div>Cheers,<br data-mce-bogus="1"></div><div>Roberto<br data-mce-bogus="1"></div><div><br></div><div data-marker="__SIG_PRE__">-----<br>Roberto R. Panepucci, PhD</div><div data-marker="__SIG_PRE__">Associate Coordinator - CTINano<br>Senior Researcher - CTI_DINAM/CGPS<br>Centro de Tecnologia da Informação Renato Archer - CTI<br>Ministério da Ciência, Tecnologia e Inovação - MCTI<br>https://www.gov.br/mcti/pt-br/rede-mcti/cti</div><div><br><span id="zwchr" data-marker="__DIVIDER__">----- Em 26 de Out de 2021, em 17:48, Maduzia, Joseph Walter <jmaduzi2@illinois.edu> escreveu:<br></span></div><div data-marker="__QUOTED_TEXT__"><blockquote style="border-left:2px solid #1010FF;margin-left:5px;padding-left:5px;color:#000;font-weight:normal;font-style:normal;text-decoration:none;font-family:Helvetica,Arial,sans-serif;font-size:12pt;">
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<p class="MsoNormal">Hello,</p>
<p class="MsoNormal"> </p>
<p class="MsoNormal">Does anyone have any suggestions for mask materials to protect Al in HF 49% for SiO2 removal in SOI wafer? The device is SOI, ICP DRIE etched to glass, HF etch to undercut and free devices, but have Al contact pads and AL is dep’d first.
Typically we use PR as pattern mask, but the Al is etching behind the PR. In this case the Al is deposited first, so although order of operations change might help, it’s not a good option atm.</p>
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Thank you for any suggestions you might have!</p>
<p class="MsoNormal"><b><span style="color:#13294b;text-transform:uppercase">JOE MADUZIA</span></b><span style="color:black"><br>
</span><i><span style="color:#13294b">MNMS Laboratory Specialist</span></i><span style="color:black"><br>
<br>
</span><span style="color:#13294b">The Grainger College of Engineering</span><span style="color:black"><br>
</span><span style="color:#13294b">Mechanical Science and Engineering</span><span style="color:black"><br>
<br>
</span><span style="color:#13294b">2239 Sidney Lu Mechanical Engineering Bldg</span><span style="color:black"><br>
</span><span style="color:#13294b">1206 W. Green</span><span style="color:black"><br>
</span><span style="color:#13294b">Urbana, IL 61801</span><span style="color:black"><br>
</span><span style="color:#13294b">217.244.6302 | </span><a href="mailto:jmaduzi2@illinois.edu" target="_blank" rel="nofollow noopener noreferrer"><span style="color:#0563c1">jmaduzi2@illinois.edu</span></a><br data-mce-bogus="1"></p>
<p class="MsoNormal"><a href="https://cleanroom.mechse.illinois.edu/" target="_blank" rel="nofollow noopener noreferrer"><span style="color:#0563c1">https://cleanroom.mechse.illinois.edu/</span></a><span style="color:black"><br>
<br>
</span><a href="http://illinois.edu/" target="_blank" rel="nofollow noopener noreferrer"><span style="text-decoration:none"><img style="width:1.3958in;height:0.3645in" id="Picture_x0020_1" src="cid:image001.png@01D7CA80.EEDBB600" width="134" height="35" border="0"></span></a><span style="color:black"><br>
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</span><i><span style="color:#666666">Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure.</span></i></p>
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<br>_______________________________________________<br>labnetwork mailing list<br>labnetwork@mtl.mit.edu<br>https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<br></blockquote></div></div>
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