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<p class="MsoNormal">Hi Joe,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">The bubbles you are seeing are common, but typically only on thicker SPR-220 coats (~10+µm) that are processed without, or with too short of, a wait time. The samples must rehydrate to complete the photo-reaction. A wait time between exposure
and your post-exposure bake usually allows this rehydration to occur. <o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">That being said, I’m guessing your spins are fairly thin with the 4.5 variant so it may be an issue with your cleanroom humidity. If that is particularly low the samples will take longer to rehydrate, or may not rehydrate properly if the
humidity is too low.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">-Dave<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal"><b><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:#BB0000;background:white">Dave Hollingshead </span></b><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:#333333"><br>
<span style="background:white">Manager of Research Operations – Nanotech West Lab<br>
<b>The Ohio State University</b></span><o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:#333333;background:white">Suite 100, 1381 Kinnear Road, Columbus, OH 43212</span><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:#333333"><br>
<span style="background:white">614.292.1355 Office</span><br>
</span><span style="color:#333333"><a href="mailto:hollingshead.19@osu.edu"><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:blue;background:white">hollingshead.19@osu.edu</span></a></span><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:#333333;background:white"> </span><span style="color:#333333"><a href="http://osu.edu/"><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:blue;background:white">osu.edu</span></a></span><span style="color:#333333"><o:p></o:p></span></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal"><o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal"><b>From:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> <b>
On Behalf Of </b>Maduzia, Joseph Walter<br>
<b>Sent:</b> Thursday, November 4, 2021 09:59<br>
<b>To:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> [labnetwork] PR bubbles where exposed<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Hello All!<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Thank you again for all your feedback on SiO2 etch around Al. It has been very helpful and we are moving down multiple paths suggested via the Lab Network to try to solve the issue. More to come once we solve it!<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">I have another issue I was hoping for feedback on. We have bubbling in our PR (SPR-220-4.5) (pos tone) that we haven’t been able to track the source of. It only bubbles during exposure and only where it is exposed. Unexposed areas are unaffected.
I’ve attached some images of the bubbling where you can see the exposed (lighter) and unexposed (darker) areas. The bubbles are visible to the naked eye. The wafer is silicon w a dry thermally grown SiO2 surface. We typically expose via EV620 mask aligner
with Vac+HardContact. However, even in a flood exposure with the mask just set lightly down it still bubbles. Without a mask there are also bubbles randomly distributed across the wafer, but they don’t get stuck to the mask so they don’t pop. We tried various
pre-bakes, HMDS coat vs not, piranha treat vs not. In the past these bubbles show up, we trial and error to get rid of them and suddenly they disappear. Our process, although seemingly repeatable, does not yield repeatable results.
<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Thank You,<o:p></o:p></p>
<p class="MsoNormal"><b><span style="color:#13294B;text-transform:uppercase">JOE MADUZIA</span></b><span style="color:black"><br>
</span><i><span style="color:#13294B">MNMS Laboratory Specialist</span></i><span style="color:black"><br>
<br>
</span><span style="color:#13294B">The Grainger College of Engineering</span><span style="color:black"><br>
</span><span style="color:#13294B">Mechanical Science and Engineering</span><span style="color:black"><br>
<br>
</span><span style="color:#13294B">2239 Sidney Lu Mechanical Engineering Bldg</span><span style="color:black"><br>
</span><span style="color:#13294B">1206 W. Green<br>
Urbana, IL 61801</span><span style="color:black"><br>
</span><span style="color:#13294B">217.244.6302 | </span><a href="mailto:jmaduzi2@illinois.edu">jmaduzi2@illinois.edu</a><o:p></o:p></p>
<p class="MsoNormal"><a href="https://urldefense.com/v3/__https:/cleanroom.mechse.illinois.edu/__;!!KGKeukY!kT5USH9itQ6c35ZM0vr1WvWJcDWY01FqzDHf4aDrhwus1XQwl2UGapNHHk-HnXYYYKeI1Q$">https://cleanroom.mechse.illinois.edu/</a><span style="color:black"><br>
<br>
</span><a href="https://urldefense.com/v3/__http:/illinois.edu/__;!!KGKeukY!kT5USH9itQ6c35ZM0vr1WvWJcDWY01FqzDHf4aDrhwus1XQwl2UGapNHHk-HnXaR68Z1lw$"><span style="color:windowtext;text-decoration:none"><img border="0" width="134" height="35" style="width:1.3958in;height:.3645in" id="Picture_x0020_1" src="cid:image001.png@01D7D174.0E5A4F10"></span></a><span style="color:black"><br>
<br>
</span><i><span style="color:#666666">Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure.</span></i><o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
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