<html xmlns:v="urn:schemas-microsoft-com:vml" xmlns:o="urn:schemas-microsoft-com:office:office" xmlns:w="urn:schemas-microsoft-com:office:word" xmlns:m="http://schemas.microsoft.com/office/2004/12/omml" xmlns="http://www.w3.org/TR/REC-html40">
<head>
<meta http-equiv="Content-Type" content="text/html; charset=utf-8">
<meta name="Generator" content="Microsoft Word 15 (filtered medium)">
<style><!--
/* Font Definitions */
@font-face
{font-family:"Cambria Math";
panose-1:2 4 5 3 5 4 6 3 2 4;}
@font-face
{font-family:Calibri;
panose-1:2 15 5 2 2 2 4 3 2 4;}
/* Style Definitions */
p.MsoNormal, li.MsoNormal, div.MsoNormal
{margin:0in;
font-size:11.0pt;
font-family:"Calibri",sans-serif;}
a:link, span.MsoHyperlink
{mso-style-priority:99;
color:blue;
text-decoration:underline;}
span.pfptpreheader1
{mso-style-name:pfptpreheader1;
display:none;}
span.pfpttitlemso1
{mso-style-name:pfpttitlemso1;
font-family:"Arial",sans-serif;
color:black;
font-weight:bold;}
span.pfptsubtitlemso1
{mso-style-name:pfptsubtitlemso1;
font-family:"Arial",sans-serif;}
span.EmailStyle35
{mso-style-type:personal-reply;
font-family:"Calibri",sans-serif;
color:windowtext;}
.MsoChpDefault
{mso-style-type:export-only;
font-size:10.0pt;}
@page WordSection1
{size:8.5in 11.0in;
margin:1.0in 1.0in 1.0in 1.0in;}
div.WordSection1
{page:WordSection1;}
--></style><!--[if gte mso 9]><xml>
<o:shapedefaults v:ext="edit" spidmax="1026" />
</xml><![endif]--><!--[if gte mso 9]><xml>
<o:shapelayout v:ext="edit">
<o:idmap v:ext="edit" data="1" />
</o:shapelayout></xml><![endif]-->
</head>
<body lang="EN-US" link="blue" vlink="purple" style="word-wrap:break-word">
<div class="WordSection1">
<p class="MsoNormal">Hi Long,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">We do this routinely with our DRIE system. As Jer mentioned, we typically use small drops of santovac 5 oil to adhere the two wafers together to provide thermal conduction. In our case we see etch rate changes or PR “burning” without a
good thermal conductor between the samples.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">-Dave<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<div>
<div style="border:none;border-top:solid #E1E1E1 1.0pt;padding:3.0pt 0in 0in 0in">
<p class="MsoNormal"><b>From:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> <b>
On Behalf Of </b>Jeremy Upham<br>
<b>Sent:</b> Monday, April 11, 2022 23:08<br>
<b>Cc:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> Re: [labnetwork] RIE through Silicon<o:p></o:p></p>
</div>
</div>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal"><span class="pfptpreheader1"><span style="font-size:1.0pt;color:white">I think your plan could work, so I'm not sure that I see the problem In my experience the carbon in the PR can contribute to the plasma chemistry and affect the etch,
so I tend to use vacuum grease as a thermally conducting binder between </span></span><span style="font-size:1.0pt;color:white"><o:p></o:p></span></p>
</div>
<div>
<div>
<p class="MsoNormal">I think your plan could work, so I'm not sure that I see the problem<o:p></o:p></p>
</div>
<div>
<p class="MsoNormal"><o:p> </o:p></p>
</div>
<div>
<p class="MsoNormal">In my experience the carbon in the PR can contribute to the plasma chemistry and affect the etch, so I tend to use vacuum grease as a thermally conducting binder between the etched sample and the backing wafer instead. Though your system
may well work for your recipe.<o:p></o:p></p>
</div>
<div>
<p class="MsoNormal"><o:p> </o:p></p>
</div>
<div>
<p class="MsoNormal">Hope that helps,<o:p></o:p></p>
</div>
<div>
<p class="MsoNormal"><o:p> </o:p></p>
</div>
<div>
<div>
<div>
<div>
<div>
<p class="MsoNormal">Jer Upham PhD<br>
Senior Lab Manager / Research Scientist<br>
Quantum Photonics Group<br>
University of Ottawa<br>
Tel.: 1 (613) 562-5800 ext 7325<o:p></o:p></p>
</div>
</div>
</div>
<p class="MsoNormal"><o:p> </o:p></p>
</div>
</div>
</div>
<p class="MsoNormal"><o:p> </o:p></p>
<div>
<div>
<p class="MsoNormal">On Mon, Apr 11, 2022 at 6:54 PM Chang, Long <<a href="mailto:lvchang@central.uh.edu">lvchang@central.uh.edu</a>> wrote:<o:p></o:p></p>
</div>
<blockquote style="border:none;border-left:solid #CCCCCC 1.0pt;padding:0in 0in 0in 6.0pt;margin-left:4.8pt;margin-right:0in">
<div>
<div>
<p class="MsoNormal"><b><span style="font-size:9.0pt;color:#FF4233">Attention : courriel externe | external email</span></b><span style="font-size:9.0pt;color:#FF4233"><o:p></o:p></span></p>
</div>
<div>
<p class="MsoNormal">Hi Guys, <o:p></o:p></p>
<div>
<p class="MsoNormal"><o:p> </o:p></p>
</div>
<div>
<p class="MsoNormal">I have an Oxford RIE with backside Helium. I want to etch through the silicon wafer (380um thick). The largest pattern is a 1mm diameter circle. My plan is to ride the 4” sample wafer on a 4" carrier wafer with PR. Does anyone have a good
solution to this problem?<o:p></o:p></p>
</div>
<div>
<p class="MsoNormal"><o:p> </o:p></p>
</div>
<div>
<p class="MsoNormal">Thanks,<o:p></o:p></p>
<div>
<div>
<p class="MsoNormal"><span style="color:black">Long<o:p></o:p></span></p>
</div>
</div>
<p class="MsoNormal"><o:p> </o:p></p>
</div>
</div>
</div>
</blockquote>
</div>
</div>
</body>
</html>