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<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif;color:#1F497D">We sputter or evaporate a thick layer of Al on the wafer backside 3um it works as an etch stop then you remove it with Al etch.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif">Richard Morrison<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif">PMTS<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif">Draper Laboratory<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif">555 Technology Square<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif">Cambridge Ma 02139<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif">Office: 617-258-3420<o:p></o:p></span></p>
<p class="MsoNormal"><span style="font-size:11.0pt;font-family:"Calibri",sans-serif">Cell: 508-930-3461<o:p></o:p></span></p>
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<p class="MsoNormal"><b><span style="font-size:11.0pt;font-family:"Calibri",sans-serif">From:</span></b><span style="font-size:11.0pt;font-family:"Calibri",sans-serif"> labnetwork <labnetwork-bounces@mtl.mit.edu>
<b>On Behalf Of </b>Jeremy Upham<br>
<b>Sent:</b> Monday, April 11, 2022 11:08 PM<br>
<b>Cc:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> Re: [labnetwork] RIE through Silicon<o:p></o:p></span></p>
<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">I think your plan could work, so I'm not sure that I see the problem<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">In my experience the carbon in the PR can contribute to the plasma chemistry and affect the etch, so I tend to use vacuum grease as a thermally conducting binder between the etched sample and the backing wafer instead. Though your system
may well work for your recipe.<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Hope that helps,<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Jer Upham PhD<br>
Senior Lab Manager / Research Scientist<br>
Quantum Photonics Group<br>
University of Ottawa<br>
Tel.: 1 (613) 562-5800 ext 7325<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">On Mon, Apr 11, 2022 at 6:54 PM Chang, Long <<a href="mailto:lvchang@central.uh.edu">lvchang@central.uh.edu</a>> wrote:<o:p></o:p></p>
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<p class="MsoNormal"><b><span style="font-size:9.0pt;font-family:"Calibri",sans-serif;color:#FF4233">Attention : courriel externe | external email</span></b><span style="font-size:9.0pt;font-family:"Calibri",sans-serif;color:#FF4233"><o:p></o:p></span></p>
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<p class="MsoNormal">Hi Guys, <o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">I have an Oxford RIE with backside Helium. I want to etch through the silicon wafer (380um thick). The largest pattern is a 1mm diameter circle. My plan is to ride the 4” sample wafer on a 4" carrier wafer with PR. Does anyone have a good
solution to this problem?<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Thanks,<o:p></o:p></p>
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<p class="MsoNormal"><span style="color:black">Long<o:p></o:p></span></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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