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This would seem to be a good application for electron beam sectioning or milling.</div>
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Alternately, I'm told water jet milling can cut pretty thick sections and leave a reasonably clean cut. Not sure if it (the water spraying around) would be too violent for your surface to be analyzed.
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I'm sure others more knowledgeable will be weighing in...</div>
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Mac</div>
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Harvard CNS<br>
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<div id="divRplyFwdMsg" dir="ltr"><font face="Calibri, sans-serif" style="font-size:11pt" color="#000000"><b>From:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> on behalf of Beall, James A. (Fed) <james.beall@nist.gov><br>
<b>Sent:</b> Thursday, June 9, 2022 3:09 PM<br>
<b>To:</b> labnetwork@mtl.mit.edu <labnetwork@mtl.mit.edu><br>
<b>Subject:</b> [labnetwork] Wire saw cross sectioning service</font>
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<div class="PlainText">Hello,<br>
<br>
We are fabricating micro machined silicon feedhorns (stacked silicon platelets that are gold plated) that we would like to have cross sectioned to analyze the final horn profile and gold plating quality. The parts a 1.5 cm x 2 cm x 2 cm and the waveguide ID
ranges from 0.5 - 3 mm.<br>
<br>
I’ve done this in the past with a low speed Buehler diamond blade saw followed by lapping but it is hard to hit the diameter of the waveguide and is tedious to lap down.<br>
<br>
Ted Pella and Princeton Scientific sell ~$10K wire saws which would probably work but for only a couple of samples we are looking for a company that might perform this device.<br>
<br>
Any recommendations?<br>
<br>
Thanks very much,<br>
<br>
Jim Beall<br>
NIST Boulder<br>
Quantum Sensors Project<br>
Boulder, CO<br>
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