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<p class="MsoNormal"><span style="color:#1F497D;mso-fareast-language:EN-US">Agreed, tried it once in a dirty evaporator and it makes a difficult to remove low density coating. Did evaporate ok with e-beam though.
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<p class="MsoNormal"><span style="color:#1F497D;mso-fareast-language:EN-US">Another cleanroom here less concerned about such things sputters it regularly for Zn doped Li Niobate applications. All depends what you want out of your shared tools.<o:p></o:p></span></p>
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<p class="MsoNormal"><b><span lang="EN-US">From:</span></b><span lang="EN-US"> labnetwork <labnetwork-bounces@mtl.mit.edu>
<b>On Behalf Of </b>Shawn Wagoner<br>
<b>Sent:</b> 01 February 2023 12:23<br>
<b>To:</b> Malhotra, Sandra Guy <sandra.malhotra@tamu.edu>; Fab Network <labnetwork@mtl.mit.edu><br>
<b>Subject:</b> Re: [labnetwork] Question about DC sputtering of zinc<o:p></o:p></span></p>
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<p class="MsoNormal" style="line-height:16.5pt;background:#F7F9FA"><strong><span lang="EN-US" style="font-size:10.5pt;font-family:"Calibri",sans-serif;color:#8D3970">CAUTION:</span></strong><span lang="EN-US" style="font-size:10.5pt;color:#8D3970"> This e-mail
originated outside the University of Southampton. <o:p></o:p></span></p>
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<p class="MsoNormal"><span lang="EN-US">I would not allow Zinc in any system I ran at Binghamton University. I would not even allow it in the cleanroom. It represents a significant contamination risk for shared use facilities. If I were fortunate enough
to have two systems, one clean and one “dirty”, I might consider it in the dirty system. Its vapor pressure is so high I am not sure there is much you can do to cover it up with Ti.
<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US"><o:p> </o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">Shawn<o:p></o:p></span></p>
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<p class="MsoNormal"><b><span lang="EN-US">From:</span></b><span lang="EN-US"> labnetwork <<a href="mailto:labnetwork-bounces@mtl.mit.edu">labnetwork-bounces@mtl.mit.edu</a>>
<b>On Behalf Of </b>Malhotra, Sandra Guy<br>
<b>Sent:</b> Monday, January 30, 2023 4:40 PM<br>
<b>To:</b> Fab Network <<a href="mailto:labnetwork@mtl.mit.edu">labnetwork@mtl.mit.edu</a>><br>
<b>Subject:</b> [labnetwork] Question about DC sputtering of zinc<o:p></o:p></span></p>
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<p class="MsoNormal" style="background:white"><span lang="EN-US" style="font-size:12.0pt;color:black">Howdy All from AggieFab,<o:p></o:p></span></p>
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<p class="MsoNormal" style="background:white"><span lang="EN-US" style="font-size:12.0pt;color:black">We have a user who requested permission to sputter zinc in our shared Lesker PVD75 DC sputtering tool. On the Lesker website, there is the following note:<o:p></o:p></span></p>
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<p class="MsoNormal" style="background:white"><span lang="EN-US" style="font-size:12.0pt;color:black"><o:p> </o:p></span></p>
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<p class="MsoNormal" style="background:white"><span class="contentpasted0"><span lang="EN-US" style="font-size:12.0pt;font-family:"Arial",sans-serif;color:#212529;background:white">"This material has a relatively </span></span><strong><span lang="EN-US" style="font-size:12.0pt;font-family:"Arial",sans-serif;color:#212529;background:white">high
vapor pressure at low temperatures</span></strong><span class="contentpasted0"><span lang="EN-US" style="font-size:12.0pt;font-family:"Arial",sans-serif;color:#212529;background:white"> which can cause ppm level contamination in the chamber and subsequent
films. Careful consideration should be taken before this material is used in any deposition system. For this reason, some users prefer to use only dedicated vacuum chambers for deposition."</span></span><span lang="EN-US" style="font-size:12.0pt;color:black"><o:p></o:p></span></p>
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<p class="MsoNormal" style="background:white"><span class="contentpasted0"><span lang="EN-US" style="font-size:12.0pt;font-family:"Arial",sans-serif;color:#212529;background:white">I'd like to ask the group if they allow zinc depositions in their shared tools
if they follow it by a thorough paste with another material, like Ti? Or if this material is prohibited because it is problematic. </span></span><span lang="EN-US" style="font-size:12.0pt;color:black"><o:p></o:p></span></p>
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<p class="MsoNormal" style="background:white"><span class="contentpasted0"><span lang="EN-US" style="font-size:12.0pt;font-family:"Arial",sans-serif;color:#212529;background:white">Thanks in advance for any inputs you may have.</span></span><span lang="EN-US" style="font-size:12.0pt;color:black"><o:p></o:p></span></p>
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<p class="MsoNormal" style="background:white"><span lang="EN-US" style="font-size:12.0pt;color:black"><o:p> </o:p></span></p>
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<p class="MsoNormal" style="background:white"><span class="contentpasted0"><span lang="EN-US" style="font-size:12.0pt;font-family:"Arial",sans-serif;color:#212529;background:white">Best,</span></span><span lang="EN-US" style="font-size:12.0pt;color:black"><o:p></o:p></span></p>
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<p class="MsoNormal"><b><span lang="EN-US">Sandra G. Malhotra, Ph.D. </span></b><span lang="EN-US">| Technical Lab Manager
<o:p></o:p></span></p>
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<p class="MsoNormal"><span lang="EN-US">AggieFab Nanofabrication Facility<o:p></o:p></span></p>
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<p class="MsoNormal"><span lang="EN-US"><a href="https://eur03.safelinks.protection.outlook.com/?url=https%3A%2F%2Faggiefab.tamu.edu%2F&data=05%7C01%7Codc1n08%40soton.ac.uk%7Cf768842984b24838cb2d08db0450d4e6%7C4a5378f929f44d3ebe89669d03ada9d8%7C0%7C0%7C638108517696830366%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C2000%7C%7C%7C&sdata=F%2FIJW1EiWWibsTx7iwdmFJBSYGo4%2F%2BlSkC8u%2F6dtk6I%3D&reserved=0" title="https://aggiefab.tamu.edu/">https://aggiefab.tamu.edu/</a><o:p></o:p></span></p>
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<p class="MsoNormal"><span lang="EN-US">Department of Electrical & Computer Engineering, College of Engineering | Texas A&M University<o:p></o:p></span></p>
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<p class="MsoNormal"><span lang="EN-US">3253 TAMU | College Station, TX 77843<o:p></o:p></span></p>
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<p class="MsoNormal"><span lang="EN-US">ph: 979.845.3199 | <a href="mailto:sandra.malhotra@tamu.edu">sandra.malhotra@tamu.edu</a><o:p></o:p></span></p>
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