<html dir="ltr"><head></head><body style="text-align:left; direction:ltr;"><div>Dear Lab members,</div><div><br></div><div>I am the proud owner of the following STS 320PC tool:-</div><div><br></div><div><a href="https://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=79584">https://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=79584</a></div><div><br></div><div>You can see many photos of it at the above link.</div><div>The vintage seems to be around 1995.</div><div><br></div><div>The equipment is functional, but it has come to me without any manuals.</div><div>I was wondering if anyone can be so kind to send me any manuals for this old but very simple tool, so as I can then find a new home for it ?</div><div>Please consider that it does help the environment when one re-cycles such expensive and costly to make fab equipment in this way.</div><div><br></div><div>Here is a more detailed description about this tool, which has a DOS operating system:-</div><div><br></div><div>SDI ID: 79584</div><div>Manufacturer: SPTS </div><div>Model: 320 PC</div><div>Description: Reactive Ion Etcher -Manual loading for laboratory use</div><div>Version: UP TO 200 mm</div><div>Vintage: 01.05.1995</div><div>Quantity: 1</div><div>Comments: </div><div>-Manual loading</div><div>-includes PC control system.</div><div>-Software version 2.3.00 datalog</div><div>-includes STS end-point detector</div><div>-includes Leybold mechanical pump with oil mist filter.</div><div>-includes Leybold turbo pump</div><div>-Leybold turbo pump controller type: Turbotronix NT 151 / 361</div><div>-RF generator type: ENI ACG6</div><div>-Includes process module chiller type BETTA TECH CU500. COOLANT: GALDEN.(SEE SDI ID 106971)</div><div>-Cathode diameter: 30 cm</div><div>-Cathode area: 706.5 cm2</div><div>-RF forward power range: 10 to 600 watts</div><div>-Chamber max pressure: 500 mtorr</div><div>-Chamber base vacuum: 1mTorr</div><div>-Substrate sizes: 2 to 8 inch and small fragments</div><div>-Number of gas lines available: 8</div><div>Reactive Ion Etching is a technique which is used to selectively etch thin films in micro-electronic devices. It used both physical and chemical etching. An appropriate gas mixture needs to be selected to obtain the best process results.</div><div>Etch rates can be adjusted by changing the electrode bias, RF power, chamber pressure and the gas flow rates. RIE can provide highly anisotropic surfaces.</div><div>With the STS 320PC, recipes can be changed easily to allow the processing of new materials.</div><div>POSSIBLE SUBSTRATE SIZES: 2 INCH, 4 INCH, 5, INCH, 6 INCH AND 8 INCH, FRAGMENTS</div><div>GASES USED: CF4, O2, CHF3, SF6, CF4 + N2</div><div>SUBSTRATES THAT CAN BE ETCHED: SiO2, PolySilicon, SiN</div><div><br></div><div>Yours sincerely,</div><div><br></div><div>SDI Fabsurplus Italia SRL</div><div>Stephen Howe</div><div>Company Owner</div><div>email: <a href="mailto:info@fabsurplus.com">info@fabsurplus.com</a></div><div>Mobile (Italy) : +39 335-710-7756</div><div>WWW.FABSURPLUS.COM</div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div></body></html>